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Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application
Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application
Specifications
Brand Name :
PAM-XIAMEN
Place of Origin :
China
MOQ :
1-10,000pcs
Price :
By Case
Payment Terms :
T/T
Supply Ability :
10,000 wafers/month
Delivery Time :
20-25 working days
Description

Borosilicate Lid glass wafer with ultra thin thickness for fiber optic AWG application

Glass Wafer

We are one of the world’s leading glass wafer suppliers, provide thin & ultra-thin glass wafers and substrates which are made of different materials, such as Borofloat, Fused Silica & Quartz, BK7, Soda Lime etc for MEMS, fiber optic AWG, LCD panels and OLED substrates application. These wafers are all SEMI Standards including dimensional, flat and notch specifications, also we offer custom specifications designed to your unique needs including alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, cleanliness or any other details critical to your application, including semiconductor, medical science, communications, lasers, infrared, electronics, measuring instruments, military, and aerospace.

Parameter Measurement
Diameter 2″, 4″, 6″, 8″, 10″
Dimensional Tolerance ±0.02μm
Thickness 0.12mm, 0.13mm, 0.2mm, 0.25mm, 0.45mm
Thickness Tolerance ±10μm
Thickness Variation (TTV) < 0.01mm
Flatness 1/10 Wave/Inch
Surface Roughness (RMS) <1.5nm
Scratch and Dig 5/2
Particle Size <5μm
Bow/Warp <10μm
For the customized dimension, please contact us

Glass Wafer Process

Wafer Cutting: blank wafer are ready through that thick sheets are water jetted and blocks are wire sawn

Ground Edge: the wafer edge is cylindrical grounded on the Edge Grinding Station.

Wafer Lapping: the wafer is lapped to appointed thickness.

Wafer Polishing: Polishing the wafer gives it the mirrored, super-flat surface required for the fabrication.

Wafer Cleaning: it is the removal of chemical and particle impurities without altering or damaging the wafer surface or substrate on multiple cleaning lines.

Wafer Inspection: inspect to various quality levels under the appropriate lighting condition in the Class 100 Clean Room.

Wafer Packaging: All wafers are packed in the single wafer containers.

Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application

Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application

Product tags

molecular sieves for insulating glass

,

tempered borosilicate glass

,

glass lined reactor glass thickness
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Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application

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Product Detail
Brand Name :
PAM-XIAMEN
Place of Origin :
China
MOQ :
1-10,000pcs
Price :
By Case
Payment Terms :
T/T
Supply Ability :
10,000 wafers/month
Contact Supplier
Borosilicate Lid Glass Wafer With Ultra Thin Thickness For Fiber Optic AWG Application

XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

Active Member
6 Years
fujian, xiamen
Since 1990
Business Type :
Manufacturer, Exporter, Seller
Main Products :
GaN Wafer, SiC Wafer, GaAs Wafer
Total Annual :
10 Million-50 Million
Employee Number :
50~100
Certification Level :
Active Member

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