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Undoped GaSb Wafer , 2”, As-Cut Wafer , Mechanical Wafer , Or Polished Wafer
Undoped GaSb Wafer , 2”, As-Cut Wafer , Mechanical Wafer , Or Polished Wafer
Specifications
Brand Name :
PAM-XIAMEN
Place of Origin :
China
MOQ :
1-10,000pcs
Price :
By Case
Payment Terms :
T/T
Supply Ability :
10,000 wafers/month
Delivery Time :
5-50 working days
product name :
As-Cut Wafer GaSb Wafer
Conduction Type :
P type
Dopant :
Undoped
Wafer Thickness :
500±25um
other name :
GaSb Mechanical Wafer
Wafer Diameter :
2 inch
Description

Undoped GaSb Wafer, 2”, As-Cut Wafer, Mechanical Wafer, Or Polished Wafer
PAM-XIAMEN offers GaSb wafer – gallium antimonide which are grown by LEC(Liquid Encapsulated Czochralski) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100).
Gallium antimonide (GaSb) is a semiconducting compound of gallium and antimony of the III-V family.It has a lattice constant of about 0.61 nm. GaSb can be used for Infrared detectors,infrared LEDs and lasers and transistors, and thermophotovoltaic systems.

2" GaSb Wafer Specification

ItemSpecifications
DopantUndoped
Conduction TypeP-type
Wafer Diameter2"
Wafer Orientation(100)±0.5°
Wafer Thickness500±25um
Primary Flat Length16±2mm
Secondary Flat Length8±1mm
Carrier Concentration(1-2)x1017cm-3
Mobility600-700cm2/V.s
EPD<2x103cm-2
TTV<10um
BOW<10um
WARP<12um
Laser Markingupon request
Suface FinishP/E, P/P
Epi Readyyes
PackageSingle wafer container or cassette

Band structure and carrier concentration of GaSb Wafer

Band structure and carrier concentration of GaSb Wafer include Basic Parameters,Temperature, Dependences,Dependence of the Energy Gap on Hydrostatic Pressure, Effective Masses, Donors and Acceptors

Basic Parameters

Energy gap0.726 eV
Energy separation (EΓL) between Γ and L valleys0.084 eV
Energy separation (EΓX) between Γ and X valleys0.31 eV
Energy spin-orbital splitting0.80 eV
Intrinsic carrier concentration1.5·1012 cm-3
Intrinsic resistivity103 Ω·cm
Effective conduction band density of states2.1·1017 cm-3
Effective valence band density of states1.8·1019 cm-3

Undoped GaSb Wafer , 2”, As-Cut Wafer , Mechanical Wafer , Or Polished WaferBand structure and carrier concentration of GaSb. 300 K
Eg= 0.726 eV
EL = 0.81 eV
EX = 1.03 eV
Eso = 0.8 eV

Temperature Dependences

Temperature dependence of the energy gap

Eg = 0.813 - 3.78·10-4·T2/(T+94) (eV),
where T is temperature in degrees K (0 < T < 300).

Temperature dependence of energy EL

EL = 0.902 - 3.97·10-4·T2/(T+94) (eV)

Temperature dependence of energy EX

EX = 1.142 - 4.75·10-4·T2/(T+94) (eV)

Effective density of states in the conduction band

Nc = 4.0·1013·T3/2 (cm-3)

Effective density of states in the conduction band

Nc = 4.0·1013·T3/2 (cm-3)

Effective density of states in the valence band

Nv = 3.5·1015·T3/2 (cm-3)

Undoped GaSb Wafer , 2”, As-Cut Wafer , Mechanical Wafer , Or Polished WaferThe temperature dependences of the intrinsic carrier concentration.

Dependences on Hydrostatic Pressure

Eg = Eg(0) + 14.5·10-3P (eV)
EL = EL(0) + 5.0·10-3P (eV)
EX = EX(0) - 1.5·10-3P (eV),
where P is pressure in kbar.

Energy Gap Narrowing at High Doping Levels

Undoped GaSb Wafer , 2”, As-Cut Wafer , Mechanical Wafer , Or Polished WaferEnergy gap narrowing versus acceptor acceptor doping density.
Curve is calculated for p-GaSb according to
Points show experimental results

For n-type GaSb

Eg = 13.6·10-9·Nd1/3 + 1.66·10-7·Nd1/4 + 119·10-12·Nd1/2 (eV)

For p-type GaSb

Eg = 8.07·10-9·Na1/3 + 2.80·10-7·Na1/4+ 4.12·10-12·Na1/2 (eV)

Effective Masses

Electrons:

For Γ-valleymΓ = 0.041mo
In the L- valley the surfaces of equal energy are ellipsoids
ml= 0.95mo
mt= 0.11mo
Effective mass of density of states
mL= 16(mlmt2)1/3= 0.57mo
In the X- valley the surfaces of equal energy are ellipsoids
ml= 1.51mo
mt= 0.22mo
Effective mass of density of states
mX= 9(mlmt2)1/3= 0.87mo

Holes:

Heavymh = 0.4mo
Lightmlp = 0.05mo
Split-off bandmso = 0.14mo
Effective mass of density of statesmv = 0.8mo
Effective mass of density of conductivity
mvc = 0.3mo

Donors and Acceptors

Undoped GaSb Wafer , 2”, As-Cut Wafer , Mechanical Wafer , Or Polished WaferThe diagram of IV group donor states

Ionization energies of shallow donors (eV)

Te(L)Te(X)Se(L)Se(X)S(L)S(X)
~0.02≤0.08~0.05~0.23~0.15~0.30

For typical donor concentrations Nd≥ 1017 cm-3 the shallow donor states connected with Γ-valley did not appear.

Ionization energies of shallow acceptors (eV):

The dominant acceptor of undoped GaSb seems to be a native defect.
This acceptor is doubly ionizable

Ea1Ea2SiGeZn
0.030.1~0.01~0.009~0.037


Are You Looking for an GaSb Wafer?
PAM-XIAMEN is your go-to place for everything wafers, including GaSb wafers, as we have been doing it for almost 30 years! Enquire us today to learn more about the wafers that we offer and how we can help you with your next project. Our group team is looking forward to providing both quality products and excellent service for you!




















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Product Detail
Brand Name :
PAM-XIAMEN
Place of Origin :
China
MOQ :
1-10,000pcs
Price :
By Case
Payment Terms :
T/T
Supply Ability :
10,000 wafers/month
Contact Supplier
Undoped GaSb Wafer , 2”, As-Cut Wafer , Mechanical Wafer , Or Polished Wafer

XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

Active Member
6 Years
fujian, xiamen
Since 1990
Business Type :
Manufacturer, Exporter, Seller
Main Products :
GaN Wafer, SiC Wafer, GaAs Wafer
Total Annual :
10 Million-50 Million
Employee Number :
50~100
Certification Level :
Active Member
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