4 Inch Silicon Wafer FZ P Type Boron Doped Orientation 111 Prime Grade 4"

PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, range from the silicon substrate to compound semiconductor, PAM-XIAMEN offer semiconductor silicon substrate with diameters from 1’’ (25.4 mm) to 12’’ (300 mm). We work either Cz (Czochralski) or FZ (Float Zone) silicon substrate. The polishing process is also made according to SEMI standard( the Semiconductor Equipment and Materials International standards). We also work ultra thin wafer, silicon oxide wafer SiO2 thin film, silicon nitride wafer Si3N4 thin film, metallization on silicon substrate, and epi wafer service.

4inch Silicon Wafer FZ P Type Boron Doped Orientation 111 Prime Grade 4"

How is Silicon Wafer Made?

Growth of Silicon Ingot: single crystal silicon wafers grow via the Czochralski (CZ) and FZ method,CZ ingot growth requires chunks of virgin polycrystalline silicon, depending on the dopant, the ingot becomes a P or N type ingot (boron: P type; Phosphorus, antimony, arsenic: N type).

Slicing:Once the ingot is fully-grown, it is ground to a rough size diameter that is slightly larger than the target diameter of the final silicon wafer. The ingot has a notch or flat cut into it, the ingot proceeds to slicing. The diamond edge saw helps to minimize damage to the wafers, thickness variation, and bow and warp defects.

After the wafers have been sliced, the lapping process begins.

Cleaning:The final and most crucial step in the manufacturing process is polishing the wafer. This process takes place in a clean room. Clean rooms have a rating system that ranges from Class 1 to Class 10,000. These particles are not visible to the naked eye and in an uncontrolled atmosphere, the workers must wear clean room suits that cover their body from head to toe and do not collect or carry any particles.

Polishing:Most prime grade silicon wafers go through 2-3 stages of polishing, using progressively finer slurries or polishing compounds. The polishing process occurs in two steps, which are stock removal and final chemical mechanical polish (CMP). Both processes use polishing pads and polishing slurry. The stock removal process removes a very thin layer of silicon and is necessary to produce a wafer surface that is damage-free. After polishing, the silicon wafers proceed to a final cleaning stage that uses a long series of clean baths. This process removes surface particles, trace metals, and residues. Oftentimes a backside scrub is done to remove even the smallest particles.

Packaging:Once the wafers complete the final cleaning step, engineers sort them by specification and inspect them under high intensity lights or laser-scanning systems. This detects unwanted particles or other defects that may have occurred during fabrication. All wafers that meet the proper specifications are packaged in cassettes and sealed with tape. The wafers ship in a vacuum-sealed plastic bag with an airtight foil outer bag. This ensures that no particles or moisture enters the cassette upon leaving the clean room.

PAM-XIAMEN can offer you technology and wafer support, for more information, please visit our website: https://www.powerwaywafer.com,

send us email at sales@powerwaywafer.com and powerwaymaterial@gmail.com

Quality is our first priority. PAM-XIAMEN has been ISO9001:2008, owns and shares four modern facories which can provide quite a big range of qualified products to meet different needs of our customers, and every order has to be handled through our rigorous quality system. Test report is provided for each shipment, and each wafer are warranty.Before 1990, we are stated owned condensed matter physics research center. In 1990, center launched Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN), now it is a leading manufacturer of compound semiconductor material in China.