Potting and encapsulation involve embedding products in liquid resin to protect them from environmental damage, including corrosion and vibrations. We provide automated and semi-automated fluid dispensing machines for potting, including 2-component and epoxy dispensing systems and related vacuum systems. Our equipment includes high-precision dispensing valves, automated glue dispensers, and glue mixing machines, designed for electronics production.
Industry: Capacitor, power supply, transformer, ignition coil, reverse sensor, circuit board, electronic ballast, other electronic products, and LED products where glue potting is demanded.
Glue:
Epoxy, silica gel, AB glue, PU, and other glue that need matching
Model & Type | SZD-300 |
Certificate | CE, SGS |
Dimension | 560*650*700mm |
N.W. | 100kg |
Working Area | 300*300*100MM |
Speed | 3 turns per second |
Moving Speed | 300mm per second |
Glue & Ratio | 1:1 to 20:1, Epoxy, Silicone, PU, UV |
Repeatability | +/-0.02g |
Accuracy | +/-0.02m |
Power | AC220V or AC 380V |
Total Power Consume | 150W |
Program Memories | 99 |
Daheng Automation specializes in potting and dispensing systems for various resin applications, including 1- and 2-component polyurethanes, epoxies, silicones, and more. We provide solutions for potting and encapsulation to protect products from harsh environments, including vacuum and atmosphere pressure options. Our offerings include automatic and semi-automatic fluid dispensing machines, dual-component systems, and high-precision dispensing robots. We have the right equipment for adhesive, epoxy, or silicone applications to meet your needs.
D&H accepts a variety of customizations including size, number of tanks, temperature control, etc.
Please contact for more information!