Model & Type | PG-700 Full Auto Gluing Machine Dispenser |
Certificate | CE, SGS |
Dimension | 1500x1200x1500mm |
N.W. | 260kg |
XYZ Working Area | 700x700x80mm |
Flow Speed | 0-66g/5s, or customized |
Moving Speed | 0-300mm per second |
Glue & Ratio | 1:1 to 20:1, Epoxy, Silicone, PU, UV |
Repeatability | +/-0.02g |
Accuracy | +/- 1% |
Power | AC220V or AC 380V |
Total Power Consume | 3kw - 5kw |
Additional Function | Heating, Vacuum, Self-refilling, Self-cleaning |
Application | LED module, display, LED lights, power supply, driver, motor, sensor, and transformer and so on^ |
Advanced Liquid Dispensing Technologies for Potting and Adhesive
The evolution of liquid dispensing machines has significantly transformed the manufacturing landscape, especially in sectors requiring precise application of adhesives and potting compounds. Liquid dispenser machines specifically designed for AB potting compounds have gained prominence, offering unparalleled efficiency and accuracy in dispensing epoxy resin and hardeners. These machines are vital for applications requiring the mixing and metering of two-component systems, ensuring optimal performance in electrical potting and encapsulation tasks.
Modern automated liquid dispensing systems integrate advanced technologies for seamless operation. These systems, including adhesive dispensing and dosing machines, cater to various industrial needs by delivering consistent fluid volumes with precision. Fluid dispensing systems play a critical role in ensuring the exact ratio of epoxy resins to hardeners, facilitated by sophisticated epoxy dispensers and two-part epoxy dispensing equipment. These systems often incorporate AB dosing dispensing robots, enhancing automation and reducing human error.
The electronics industry, with its intricate requirements for potting compounds, relies heavily on specialized dispensing equipment. Adhesive dispensing systems are engineered for electrical potting compounds, providing reliable solutions for sensitive electronic components. Epoxy dispensing machines and liquid dispensing systems are specifically designed to handle resin and hardener combinations, offering meter-mix-dispense equipment that excels in potting applications.
Innovation in dispensing technology has led to the development of automatic glue dispensing machines and in-line static mixers for two-part epoxy resin and hardener dispensing. These machines feature precision metering and mixing capabilities, essential for high-quality potting and encapsulation. Adhesive dispensing robots are adept at handling high-temperature potting compounds, making them invaluable for industrial applications that demand precision and reliability.
Automated adhesive dispensing systems cater to a wide range of adhesives and sealants, optimizing application processes through efficient design and operation. Epoxy pump dispensers and metered liquid dispensers are integral components of bi-component epoxy mixing machines, ensuring accurate resin and hardener ratios. Resin dispensers for AB component liquids provide automated solutions for glue dispensing, essential for electronics potting and sealing.
State-of-the-art dispensing systems incorporate static and dynamic mixing technologies, utilizing metered pump dispensers for materials such as epoxy, PU, and silicones used in electronics. Glue dispensing systems for PCB potting and resin dispensing systems are engineered to deliver clear potting compounds with precision. These systems often include gear metering pumps and advanced mixing equipment to facilitate the dispensing of urethane potting compounds and other resins.
Industrial liquid dispensers and automated epoxy dispensers feature 2K dosing capabilities, allowing for precise mixing and dispensing. These systems are crucial for applications requiring static and dynamic mixing, such as PCB potting and electronics encapsulation. Automatic silicone dispensers equipped with cleaning, heating, and vacuuming functions further enhance operational efficiency.
Modern dispensing machines incorporate advanced features such as vacuum chamber systems, high-precision pump metering, and air bubble degas functions. These features ensure the integrity and quality of the potting and encapsulation processes, particularly in applications involving LEDs and other sensitive electronics. Epoxy resin encapsulation machines with heating capabilities prevent humidity-related issues, maintaining the performance of the encapsulated components.
The advancements in epoxy dispensing systems and automated adhesive application equipment have revolutionized the potting and encapsulation processes across various industries. With options ranging from manual glue dispensers to sophisticated vacuum encapsulation machines, these technologies provide comprehensive solutions tailored to meet diverse industrial needs. As technology continues to advance, the capabilities of liquid dispensing machines will only grow, further enhancing their role in manufacturing and production.