RTV Silicone Adhesive Single component Organosilicon Rubber Circuit Boards Insulation

Characterisitc

RTV Silicone Adhesive for Circuit Board Insulation Excellent flexibility, allowing it to endure mechanical vibrations without cracking and maintain

insulation. Low shrinkage during curing to avoid warping of circuit boards. Good thermal conductivity helps dissipate heat generated by components. High chemical

stance against solvents, oils, and mild chemicals, protecting the circuit board from corrosion. Strong UV resistance for outdoor or sunlight - exposed applications.

Outstanding electrical insulation with high dielectric strength to prevent electrical leakage. Stable dielectric constant across a wide range of frequencies and

temperatures. Easy single - component application without complex mixing. Fast room - temperature curing for improved production efficiency. Strong adhesion to

various circuit board substrates like FR - 4, ceramics, and metals.

Features

1. Curing Feature

Room - Temperature Vulcanization: This RTV silicone adhesive can cure at room temperature, eliminating the need for complex and energy - consuming heating

equipment. This feature simplifies the production process of circuit boards, reduces production costs, and is suitable for on - site repairs and small - batch production.

One - Component System: As a single - component product, it doesn't require the mixing of multiple components before use. This not only saves time but also

reduces the potential for human error in the mixing process, ensuring consistent product quality.

2. Physical Feature

Flexibility: The cured organosilicon rubber has remarkable flexibility. It can adapt to the slight deformations and vibrations that circuit boards may experience during

operation, maintaining a continuous and intact insulation layer and protecting the circuit from mechanical damage.

Low Density: With a relatively low density, it adds minimal extra weight to the circuit board. This is particularly important for applications where weight is a critical

factor, such as in aerospace and portable electronic devices.

3. Chemical Feature

Weather Resistance: It has excellent resistance to various weather conditions, including humidity, temperature changes, and ozone. This makes it suitable for both

indoor and outdoor circuit board applications, ensuring long - term stability and reliability.

Flame Retardancy: The adhesive is often formulated to be flame - retardant. In case of a fire, it can slow down the spread of flames, providing valuable time for

fire-fighting and reducing the risk of damage to the entire electrical system.

4. Electrical Feature

High Insulation Resistance: The adhesive provides a high level of electrical insulation, effectively preventing current leakage between different circuit components.

This is crucial for the proper functioning of the circuit board and the safety of the entire electrical device.

Arc Resistance: It can resist the formation and propagation of electrical arcs. This property is especially important in high - voltage circuit board applications, where

arcs can cause damage to components and pose a safety hazard.

5. Adhesion Feature

Broad Substrate Compatibility: It can adhere well to a variety of substrates commonly used in circuit boards, such as fiberglass, copper, aluminum, and plastics. This

wide - ranging compatibility allows it to be used in different types of circuit board designs and manufacturing processes.

Long - Term Adhesion Stability: The adhesion strength remains stable over time, even under the influence of temperature changes, humidity, and mechanical stress.

This ensures that the insulation layer stays firmly attached to the circuit board throughout its service life.

Factory Pictures

FAQ