6G SDI SMPTE SFP TX1310nm TX1490nm 10km SMF BIDI LC Dual Transmitters Modules Non-MSA
Functional Specification
Item Name | 6G SDI SMPTE SFP Dual Transmitter | P/N | GTS-B3460-10DCTT |
Module Type | Dual TX in BOSA, 1 fiber | Max Bit Rate | 5.94Gbps |
Form Factor | SFP BIDI | Environment | Operating -5 to 70°C |
Center Wavelength (TX) | 1310nm_TX1/1490nm_TX2 | Max Fiber Distance | 10km @ 9/125μm SMF |
Interface | Simplex LC UPC | Cable Type | Single mode fiber |
Transmitter | DFB | Receiver Part | N/A |
Power Supply Voltage | 3.3V | Supply Current | 500mA (Max) |
TX Out Power (dBm) | -8~0 dBm | Extinction Ratio | >3.5dB |
Digital Diagnostic | Support (default) | Pin Assignment | Non-MSA Pinout |
Application | SD/HD/3G/6G SDI |
Description
Gigaopto's GTS-B3460-10DCTT is a 1-fibre Bi-Directional dual channel transmitters module designed to transmit optical serial digital signals as defined in SMPTE 297-2006. It supports the data rates from 143Mb/s to 5.94Gb/s.This dual transmitter module is specifically designed for robust performance in the presence of SDI pathological patterns for SMPTE 259M, SMPTE 344M,SMPTE 292M,SMPTE 424M and ST-2081 serial rates.
It is with the SFP 20-pin connector to allow hot plug capability. It is with two independent 1310 nm and 1490 nm laser transmitters. A maximum distance of 10 km is achievable with 6Gb/s pathological signals.
Features
Commercial: -5°C~70°C
Application
Standard
Pin Definition
Pin No | Symbol | Name/Description | Power Seq. | Notes |
1 | VeeT | Transmitter Ground | 1st | |
2 | NC | Not Connected | 3rd | |
3 | NC | Not Connected | 3rd | |
4 | MOD_ABS | Module Absent, Connect to VeeT in Module | 3rd | 1 |
5 | SCL | 2-Wire Serial Interface Clock Line, LVTTL-I | 3rd | 2 |
6 | SDA | 2-Wire Serial Interface Data Line, LVTTL-I/O | 3rd | 2 |
7 | VeeT | Transmitter Ground | 1st | |
8 | TD2+ | Transmitter(1310nm) Non-Inverted DATA in. AC Coupled. CML-I | 3rd | |
9 | TD2- | Transmitter(1310nm) Inverted DATA in. AC Coupled. CML-I | 3rd | |
10 | TX2_DIS | Transmitter(1310nm) Disable Input, LVTTL-I High: Transmitter off Low: Transmitter on | 3rd | 3 |
11 | VeeR | Receiver Ground | 1st | |
12 | NC | Not Connected | 3rd | |
13 | NC | Not Connected | 3rd | |
14 | VeeT | Transmitter Ground | 1st | |
15 | VccT | Transmitter Power Supply | 2nd | |
16 | VccT | Transmitter Power Supply | 2nd | |
17 | VeeT | Transmitter Ground | 1st | |
18 | TD1+ | Transmitter(1490nm) Non-Inverted DATA in. AC Coupled. CML-I | 3rd | |
19 | TD1- | Transmitter(1490nm) Inverted DATA in. AC Coupled. CML-I | 3rd | |
20 | TX1_DIS | Transmitter(1490nm) Disable, LVTTL-I High: Transmitter off Low: Transmitter on | 3rd | 4 |
Power Seq.: Pin engagement sequence during hot plugging.
Note 1. MOD_ABS is connected to VeeT inside the module.
Note 2. SDA&SCL (I2C) shall be pulled up with 4.7k - 10kΩ resistors on host board.
Note 3. Tx2_DIS is pulled up to VccT with a 4.7k - 10kΩ resistor inside the module.
Note 4. Tx1_DIS is pulled up to VccT with a 4.7k - 10kΩ resistor inside the module.
Package Outline
Dimensions are in millimeters. All dimensions are ±0.1mm unless otherwise specified. (Unit: mm)