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0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
Specifications
Brand Name :
TOPCBS
Model Number :
BIB and test Boards
Certification :
UL94V0
Place of Origin :
Suzhou China
MOQ :
Negotiation
Price :
Negotiation
Payment Terms :
T/T
Supply Ability :
10000unit per month
Delivery Time :
10-14working days
Packaging Details :
20units per package box size 20*15*10cm
Layer count :
8Layer
Raw material :
IT180A
Finished Treatment :
Immerion Gold + OSP
Pitch Size :
0.35mm
Board thickness :
0.8mm
Line width/space :
75um/100um
Description

0.35pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board

Burn in Board is a printed circuit board which functions as a jig in the Burn-in process. The Burn-in Board is used as part of the ASIC reliability testing process during which components are stressed to detect failures. Burn in Boards consist of sockets to accommodate the tested ASICs and are designed to withstand the hot temperatures during tests.

Burn in boards utilize high grade materials. For testing up to 125C a special version of FR4 is used (High Tg FR4). For higher temperatures up to 250C a Polyimide is used; and for very high temperatures up to 300C a High grade polyimide is used.

1 . Descriptions:

What is a BIB ?

A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

2 . Specifications:

Name 0.35pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers 8
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material IT180
Thickness 0.8mm
Min Track/Spacing 75um/75um
Min Hole Size Laser 75um
Solder Mask Green
Silkscreen White
Surface Finish Immersion gold + OSP
Finished Copper 12um
Production time 10-21 working days
Lead time 2-3 days

0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

Product tags

smd led chip comparison

,

hdi printed circuit boards

,

hdi printed circuit board
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0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

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Product Detail
Brand Name :
TOPCBS
Model Number :
BIB and test Boards
Certification :
UL94V0
Place of Origin :
Suzhou China
MOQ :
Negotiation
Price :
Negotiation
Contact Supplier
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices
0.35mm Pitch Hdi Printed Circuit Boards Burn In Testing In Semiconductor Devices

Topmatch Electronics (Suzhou) Co., Limited.

Active Member
4 Years
jiangsu, suzhou
Since 1999
Business Type :
Manufacturer
Main Products :
HDI PCB, DDR4 PCB, Burn In Test PCB
Total Annual :
400 million-600 million
Employee Number :
500~1000
Certification Level :
Active Member
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