4Layer Rigid-flex PCB for Electronic cigarette mainboard
layer | 1-20 layer |
Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
Board thickness | 0.21mm to 7.0mm |
Copper thickness | 0.5 OZ to 6 oz |
Size | Max. Board Size: 580mm×1100mm |
Min. Drilled Hole Size: 0.2 mm (8 mil) | |
Min. Line Width: 4mil (0.1mm) | |
Min. Line Spacing: 4mil (0.1mm) | |
Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating |
Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
Tolerance | Shape tolerance: ±0.13 |
Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
Certificate | UL, ISO 9001, ISO 14001 |
Special requirements | Buried and blind vias+controlled impedance +BGA |
Profiling | Punching, Routing, V-CUT, Beveling |
Rigid-flex PCB can be used in consumer electronics, and meet 3D assembly requirement of products with specific flexible bending area design, .
Specifications:
Name | 4Layer Rigid-flex PCB for Electronic cigarette mainboard |
Layers | 4 |
Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
Material | DS-600D |
Min Track/Spacing | 75um/100um |
Drilling Size | 100um |
Solder Mask | Green |
Silkscreen | White |
Surface Finish | Immersion gold |
Finished Copper | 1/3OZ |
Production time | 10-21 working days |
Lead time | 2-3 days |
Capability | Standard | Advanced | Capability | Standard | Advanced | Capability | Standard | Advanced |
Line width space | 2.36/2.36mil | 2.0/2.0mil | Nath Aperture size | ±2mil | ±1.5mil | Min. SMT/QFP Pitch | 10mil | NA |
Max Copper foil thickness | 2oz | 4oz | Hole location Accuracy | ±3mil | ±2mil | Min. BGA Pitch | 12mil | NA |
Min. via hole size | Min:0.2mm | Min:0.15mm | Distance from the center of the hole to the center of the hole | ±4mil | ±3mil | Max. Test Points/Board(Universal ET) | Bed of Nail Test:16000 | NA |
Min. blind hole size | Min:0.1mm | Min:0.05mm | Hole to Edge Precision | ±3mil | ±2mil | Flying Probe Test:1-∞ | ||
Minimum semi-metalized hole | Min:0.45mm | Min:0.40mm | Layer to layer registration | ±4mil | ±3mil | v-cut Depthing | ±4mil | ±3mil |
Buried hole | 4-16 layer | 24 layer | Shape Size tolerance | ±4mil | ±3mil | v-cut Angel | 20°,30°,45° | NA |
Max production board size | 520mmX620mm | 540mmX640mm | Impedance tolerances | ±10% | ±8% | v-cut precision | ±4mil | ±3mil |
Max Aspect ratio | 8:01 | 10:01 | Min. Solder Mask Dam Width | Green Oil:3mil | Green Oil:2.5mil | |||
line width space | ±20% | ±10% | Other:4.5mil | Other:4mil | ||||
Pth Aperture size | ±3mil | ±2mil | S/M Registration | ±1.5mil | ±1.2mil |
Surface Finishes |
Electroless Nickel Immersion Gold (ENIG) |
Hot Air Solder Level (HASL, Lead and Lead‐free) |
OSP, Immersion Tin,Immersion Silver, ENEPIG |
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |