Socket Interposer LPDDR4 DDR4 High Density Interconnect Boards 0.075mm Laser Drilling

2.0mm HDI PCBs for LPDDR4 Socket Interposer stack up 4-2-4 immersion gold

HDI PCBs take advantage of the most recent technologies existing to amplify the functionality of circuit boards by means of the similar or little amounts of area. This development in board technology is motivated by the tininess of parts and semiconductor packages that assist superior characteristics in innovative new products like touch screen tabs.

HDI PCBs are described by high-density features comprising of laser micro-vias, high performance thin materials and fine lines. The better density allows extra functions per unit area. These types of multifaceted structures give the required routing resolution for large pin-count chips which are used in mobile devices and other high technology products.

The placement of the parts on the circuit board needs extra precision than conservative board design due to miniature pads and fine pitch of the circuitry on the circuit board. Leadless chips require special soldering methods and additional steps in the assembly and repair process.

The lesser weight and size of the HDI circuitry means the PCBs fit into the little spaces and have a smaller amount of mass than conservative PCB designs. The smaller weight and size even signifies that there is lesser chance of harm from mechanical shocks.

DDR4 operates with double the speed of DDR3. DDR4 operates on low operating voltage (1.2V) and higher transfer rate. The transfer rate of DDR4 is 2133 ~ 3200MT/s. DDR4 adds four new bank groups technology. Each bank group has the feature of a single-handed operation. The DDR4 can process 4 data within a clock cycle, so DDR4’s efficiency is better than DDR3. DDR4 has some additional functions such as DBI (Data Bus Inversion), CRC (Cyclic Redundancy Check) on data bus, and Command/Address parity. These functions can enhance DDR4 memory’s signal integrity and improve the stability of data transmission/access. Independent programming of individual DRAMs on a DIMM allows better control of on-die termination.

2 . Specifications:

1 . Descriptions:

What is the PCB Layout Changes Needed for DDR4 Implementation?

DDR4 or Double Data Rate 4 comes in two distinct module types. So-DIMM or small outline dual in-line memory modules (260-pins) that are in use in portable computing devices like laptops. The other module type is DIMM or dual in-line memory modules (288-pins) that are in use in devices like desktops and servers.

So, the first change in architecture is, of course, due to the pin count. The previous iteration (DDR3) uses 240-pins for a DIMM and 204-pins for a So-DIMM. Whereas the previously mentioned, DDR4 uses 288-pins for its DIMM application. With the increase in pins or contacts, DDR4 offers higher DIMM capacities, enhanced data integrity, faster download speed, and an increase in power efficiency.

Accompanying this overall improvement in performance is also a curved design (bottom) that enables better, more secure attachment, and it improves stability and strength during installation. Also, there are bench tests that confirm that DDR4 offers a 50% increase in performance and can achieve up to 3,200 MTs (Mega Transfers per Second).

Furthermore, it achieves these increases in performance in spite of using less power; 1.2 volts (per DIMM) instead of the 1.5 to 1.35-volt requirement of its predecessor. All of these changes mean that the PCB designers must reassess their design approach for the implementation of DDR4.

1. High-performance RK3399 CPU, equipped with Android/Linux systems (Android7.1), and AnTuTu score exceeds 10W
2. Support multi-format video decoding; support HDMI (4K/60fps), MIPI-DSI (2560x1600@60fps), EDP (2K@60fps), DP (4K x2K) display screen; support multi-screen display and dual-screen differential display modes.
3. Support M.2 PCIE, and external SSD can be connected.
4. Support SDIO, expandable WIFI/BT and external TF card storage.
5. Integrated GMAC Ethernet controller, scalable Gigabit Ethernet.
6. Embedded audio CODEC chip, can be directly connected to earphones and power amplifiers
7. Abundant peripheral interfaces: 2 x USB2.0 HOST, 2 x USB3.0 (can be configured as two TYPE-C), 1 x SPDIF digital audio, 2 x SPI, multiple UART and PWM, etc., which can meet a variety of application requirements.
8. Ultra-small size, 60*55*1.3 sampling B to B (board-to-board connection), ten-layer board process.