Electronic Customer Fr4 Pcb Manufacturer PCB Circuit Board HDI PCB
HDI boards, one of the fastest growing technologies in PCBs, are now available at Epec. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
Specifications:
Layers | 1-30layers |
HDI | 1+N+1&2+N+2&3+N+3 |
Material | FR4, CEM3, Rogers, High TG, High Frequency Board,Aluminum, Copper, Ceramic etc. |
Finised inner/outer copper thickness | 0.5-6oz, regular 1oz |
Finished board thickness | 0.2-7.0mm,regular 1.6mm |
Min through holes size | 0.15mm |
Max panel size | 800*1200mm |
Min panel size | 5*5mm |
Finger(Au) | 1-50U'', regular 30U'' |
Soldermask color | White, Black, Green, Red, Blue, Yellow, etc |
Silk Screen | White, Black, etc. |
Silk Screen Min Line Width | 0.1mm |
Min Trace/Gap | 3/3mil |
Surface Finish | HASL, HASL lead free, ENIG, OSP, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold |
Controlled Impedance | +/-5% |
Plugging vias capability | 0.2-0.8mm |
Outline profile | Routing/Punch/V-cut/Stamp Hole |
Cutting | V-score |
Certification | UL USA, UL Canada, ROHS, ISO13485, ISO9001, ISO14001, IATF 16949 |
Advantages:
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.