12Layer Rigid-flex HDI PCBA for Tcon LCM / Soft gold finger
Rigid-Flex designs offer the advantages of both rigid and flex circuits. The following are some benefits they provide for consumers and manufacturers.
1.Generation of T-con
The gold finger material Polymide is thin and flexible. Other areas material CCL FR4.
2 . Specifications:
Name | 12Layer Rigid-flex HDI pcb for Tcon LCM / Soft gold finger |
Layers | 12 |
Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
Material | Polymide + FR4 |
Min Track/Spacing | 75um/100um |
Drilling Size | 100um |
Solder Mask | Green |
Silkscreen | White |
Surface Finish | Immersion gold |
Finished Copper | 1/3OZ |
Production time | 10-21 working days |
Lead time | 2-3 days |
Quality Grade | Standard IPC 2 | Material | DuPont PI, Domestic Shengyi PI |
Number of Layers | 1 - 8layers | Board Size | Min 6*6mm, Max 406*610mm |
Order Quantity | 1pc - 10000+pcs | Board Thickness | 0.1mm - 0.8mm |
Build Time | 2days - 5weeks | Copper Weight (Finished) | 0.5oz - 2.0oz |
Min Tracing/Spacing | 3mil/3mil | Silkscreen Sides | As per the file |
Solder Mask Sides | As per the file | Silkscreen Color | White, Black, Yellow |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow | Surface Finish |
HASL - Hot air solder leveling Lead - free HASL - RoHS ENIG - RoHS Immersion Tin - RoHS OSP - RoHS |
Solder-stop coating---Soldermask oil | Green, White, Blue, Black, Red, Yellow | ||
Solder-stop coating---Coverlay | PI and PET film | ||
Min Annular Ring | 4mil | ||
Min Drilling Hole Diameter | 8mil | ||
Min. hole size---Drilling (PTH) | 0.2mil | Other Techniques |
Peelable solder mask Gold fingers Stiffener (only for PI/FR4 substrate) |
Min. hole size---Punching (NPTH) | 0.5mil | ||
Tolerance of dimension | ±0.05mm |