12Layer Rigid-flex HDI PCB for Tcon LCM / Soft gold finger
Flex-rigid PCBs derive their name from the fact that they use a combination of flexible and rigid circuitry areas. Like most printed circuit boards, flex-rigid boards have multiple layers but generally have more than conventional designs.
These additional conductive layers are outlined with rigid or flexible insulation depending on the product needs. Outer layers on a board — no matter how many there are — often contain exposed pads or covers for safety. Conductors are deployed for the primary rigid layer, while flexible plated through-holes are used for any additional layers both flexible and rigid.
Some projects call for using traditional rigid technologies and designs. Others have limitations that prevent manufacturers from using these larger, less flexible boards. For instance, mobile and portable devices would suffer if designed with standard boards. There are just too many moving parts and components that would perform poorly when subjected to certain conditions. Mobile devices need to be portable, lightweight and able to tolerate conditions like heat, cold and, at times, moisture.
1.Generation of T-con
The gold finger material Polymide is thin and flexible. Other areas material CCL FR4.
2 . Specifications:
Name | 12Layer Rigid-flex HDI pcb for Tcon LCM / Soft gold finger |
Layers | 12 |
Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
Material | Polymide + FR4 |
Min Track/Spacing | 75um/100um |
Drilling Size | 100um |
Solder Mask | Green |
Silkscreen | White |
Surface Finish | Immersion gold |
Finished Copper | 1/3OZ |
Production time | 10-21 working days |
Lead time | 2-3 days |
Quality Grade | Standard IPC 2 | Material | DuPont PI, Domestic Shengyi PI |
Number of Layers | 1 - 8layers | Board Size | Min 6*6mm, Max 406*610mm |
Order Quantity | 1pc - 10000+pcs | Board Thickness | 0.1mm - 0.8mm |
Build Time | 2days - 5weeks | Copper Weight (Finished) | 0.5oz - 2.0oz |
Min Tracing/Spacing | 3mil/3mil | Silkscreen Sides | As per the file |
Solder Mask Sides | As per the file | Silkscreen Color | White, Black, Yellow |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow | Surface Finish |
HASL - Hot air solder leveling Lead - free HASL - RoHS ENIG - RoHS Immersion Tin - RoHS OSP - RoHS |
Solder-stop coating---Soldermask oil | Green, White, Blue, Black, Red, Yellow | ||
Solder-stop coating---Coverlay | PI and PET film | ||
Min Annular Ring | 4mil | ||
Min Drilling Hole Diameter | 8mil | ||
Min. hole size---Drilling (PTH) | 0.2mil | Other Techniques |
Peelable solder mask Gold fingers Stiffener (only for PI/FR4 substrate) |
Min. hole size---Punching (NPTH) | 0.5mil | ||
Tolerance of dimension | ±0.05mm |