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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
Specifications
Brand Name :
TOPCBS
Model Number :
BIB and test Boards
Certification :
UL94V0
Place of Origin :
Suzhou China
MOQ :
Negotiation
Price :
Negotiation
Payment Terms :
T/T
Supply Ability :
10000unit per month
Delivery Time :
10-14working days
Packaging Details :
20units per package box size 20*15*10cm
Layer count :
12Layer
Raw material :
High Tg FR4
Finished Treatment :
Immerion Gold + OSP
Pitch Size :
0.25mm
Board thickness :
0.7mm
Line width/space :
75um/100um
Description

0.25 pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board

  • Reduced product development time
  • Increased customer confidence
  • 100% product quality and reliability
  • A forecast life expectancy
  • Reduced circuit board manufacturing costs
  • Increased profitability
  • Reduced after sales service

1 . Descriptions:

What is a BIB ?

A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

2 . Specifications:

Name 0.25pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers 12
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Material IT180
Thickness 0.7mm
Min Track/Spacing 75um/75um
Min Hole Size Laser 75um
Solder Mask Green
Silkscreen White
Surface Finish Immersion gold + OSP
Finished Copper 12um
Production time 10-21 working days
Lead time 2-3 days

High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12LayerHigh Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

Product tags

high density interconnect pcb

,

fr4 pcb datasheet

,

pcb smd
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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

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Product Detail
Brand Name :
TOPCBS
Model Number :
BIB and test Boards
Certification :
UL94V0
Place of Origin :
Suzhou China
MOQ :
Negotiation
Price :
Negotiation
Contact Supplier
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer
High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

Topmatch Electronics (Suzhou) Co., Limited.

Active Member
4 Years
jiangsu, suzhou
Since 1999
Business Type :
Manufacturer
Main Products :
HDI PCB, DDR4 PCB, Burn In Test PCB
Total Annual :
400 million-600 million
Employee Number :
500~1000
Certification Level :
Active Member
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