QSFP-DD PCB board,8Layer Plus 2 HDI, gold finger,100G material
Temp-Flex cable technology
Boosts electrical performance
Provides excellent operational margin, short lead times and minimal end-user cost via manufacturing efficiencies
Meets IEEE 802.3bj, InfiniBand EDR and SAS 3.0 specifications
Functions across a wide variety of next-generation technologies and applications
Product application
Optical module
QSFP-DD(Quad Small Form-factor Pluggable-Double Density) has a four-channel SFP-DD interface, a single-channel transmission rate of 56Gbps, and a transmission rate of 100Gbps. It is applicable to high-performance switch, router, server and host bus adapter in calculation and telecom application, with enterprise storage, high density, high-speed I/O, and multi-channel interconnection.
Specifications:
Name | QSFP-DD PCB board |
Layers | 8 |
Quality Grade | IPC 6012 Class 2,IPC 6012 Class 3 |
Material | Tachyon 100G |
Thickness | 1.0mm |
Min Track/Spacing | 75um/75um |
Drilling Size | 0.15mm |
Solder Mask | Green |
Silkscreen | White |
Surface Finish | Immersion gold + ENEPIG |
Finished Copper | 12um |
Production time | 10-21 working days |
Lead time | 2-3 days |