High Speed Design 16 Layer High TG In PCB Electronic Equipment Circuit Board

Quick detail:

Brand Name: ONESEINE/Customized

Min.Order Quantity: No

Supply Ability: 30~50 thousand ㎡/Month

Port: Shenzhen

Service: EMS/OEM/ODM

Payment Terms: T/T,Paypal,WU etc.

Layer: 16

Base Material: High Tg FR4

Copper Thickness: 1oz

Board Thickness: 2.0mm

Solder Mask Color: Green(can customized)

Silkscreen Color: White(can customized)

Surface Finishing: Immersion Gold

Application Industry: Industrial Control

Application Products: Core board

Outer Line width/space: 4/4mil

Inner Line width/space: 3.5/3.5mil

Min.Hole Size: 0.75mm

Test Way: 100% E-Test

Standard: IPC-Class2/Class 3

High TG pcb Application:

petrochemical industry,Mine industry

Industrial equipment, GPS, automotive, instrumentation, medical equipment, aircraft, military weapons, missiles, satellites

DC-DC Power Converters,Automotive,Electronics ,High Brightness LED,Power Supply circuit

What is High TG pcb?

In recent years, the demand for the production of high-Tg printed circuit board increased year by year. The following describes the high Tg circuit board in the end what is.

High Tg refers to high heat resistance. General Tg of the plate is more than 130 degrees, high Tg is generally greater than 170 degrees, medium Tg is greater than about 150 degrees, usually Tg ≥ 170 ℃ PCB, called high Tg printed circuit board. With the leap in the development of the electronics industry, especially the computer as the representative of the electronic products, toward a high functional, high multi-layer development, the need for PCB substrate materials, higher heat resistance as an important guarantee. The emergence and development of high-density mounting technology, represented by SMT and CMT, have made PCBs more and more dependent on the high heat resistance of the substrate in terms of small aperture, fine wiring and thinness.

The Tg of the substrate is improved, and the characteristics of heat resistance, moisture resistance, chemical resistance, and stability of the printed circuit board are improved and improved. The higher the TG value, the better the temperature resistance of the sheet, especially in the lead-free process, high Tg applications.

Therefore, the general FR-4 and the high Tg of the FR-4 difference is: in the hot state, especially in the moisture after heating, the material's mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition , Thermal expansion and other conditions there are differences in high-Tg products significantly better than ordinary PCB substrate material.

High TG pcb Features:

Excellent heat dissipation, 3-4 times

better than normal FR-4

Excellent thermal and insulation reliability

Superior processability and low Z-CTE

A high TG (glass transition) PCB, also known as a high-temperature PCB, is a type of printed circuit board designed to withstand elevated temperatures.

The glass transition temperature refers to the temperature at which the resin material used in a PCB transitions from a solid, rigid state to a more flexible or rubbery state. Standard PCBs typically have a glass transition temperature of around 130-140°C. However, high TG PCBs are engineered to have a higher glass transition temperature, usually ranging from 150°C to 180°C or even higher.

The higher TG value of the PCB material allows it to withstand increased heat without undergoing significant dimensional changes or loss of mechanical integrity. This makes high TG PCBs suitable for applications that involve high-temperature environments, such as power electronics, automotive electronics, aerospace systems, and industrial equipment.

High TG PCBs are usually constructed using specialized laminates with thermally stable resin systems, such as FR-4 with a higher TG rating or other advanced materials like polyimide (PI) or ceramic-filled laminates. These materials exhibit better thermal stability, lower coefficient of thermal expansion (CTE), and improved mechanical strength compared to standard PCB materials.

The manufacturing process for high TG PCBs involves specific techniques to ensure proper bonding and adhesion of copper traces, vias, and other components to withstand the higher temperatures during assembly and operation. This may include using controlled heating and cooling profiles during lamination, improved copper plating techniques, and ensuring appropriate solder mask materials and processes.

Overall, high TG PCBs offer enhanced heat resistance and reliability, making them suitable for demanding applications where exposure to elevated temperatures is a concern.