Product Description: Hdi Rigid Flex Pcb 6 Layer PI FPC With ENIG Surface Manufacturing Process Quick detail: Flex Material: Polyimide PI Rigid Material: fr4 Surface finish: Immersion gold Thickness:0.2MM Copper weight: 0...learn more
Hdi Rigid Flex Pcb 6 Layer PI FPC With ENIG Surface Manufacturing Process

Hdi Rigid Flex Pcb 6 Layer PI FPC With ENIG Surface Manufacturing Process
1000000000pcs/mon
USD0.1-1000
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ONESEINE TECHNOLOGY CO.,LTD

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