Zhuzhou Jiabang Refractory Metal Co., Ltd
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7 Years
hunan, zhuzhou
Since 2008
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Supplier Homepage > Products > Molybdenum Copper

PRODUCT CATEGORIES

Hermetic Packages Electronics

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Heat Sink

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Welding Electrodes

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X-Ray Tube Target

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Tungsten Products

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Molybdenum Products

 (23)

Tungsten Heavy Alloy

 (28)

Copper Tungsten Alloy

 (53)

Tantalum Products

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Niobium Products

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Tungsten Carbide Products

 (49)

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Molybdenum Copper

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Molybdenum Copper

24
Choose from our molybdenum copper products, find out more, and feel free to inquiry us
High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet
Hot selling!
Molybdenum Copper

High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet
Model：CPC141,CPC232,CPC300
MOQ：Negotiation
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High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet
Hot selling!
Molybdenum Copper

High Thermal Expansion Copper Molybdenum Heat Base Cu / MoCu / Cu ( CPC ) Sheet
Model：CPC141,CPC232,CPC300
MOQ：Negotiation
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Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Hot selling!
Molybdenum Copper

Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Model：HCMC024
MOQ：10pcs
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Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Molybdenum Copper

Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Model：HCMC024
MOQ：10pcs
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HCMC023 Cu - Mo Base Plate For Power Module In Automobile And Industrial Machinery
Molybdenum Copper

HCMC023 Cu - Mo Base Plate For Power Module In Automobile And Industrial Machinery
Model：HCMC023
MOQ：10 pcs
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HCMC023 Cu - Mo Base Plate For Power Module In Automobile And Industrial Machinery
Molybdenum Copper

HCMC023 Cu - Mo Base Plate For Power Module In Automobile And Industrial Machinery
Model：HCMC023
MOQ：10 pcs
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Thickness 0.2mm Gold Plated Molybdenum Copper Heat Sink For Microwave Packages
Molybdenum Copper

Thickness 0.2mm Gold Plated Molybdenum Copper Heat Sink For Microwave Packages
Model：HCMC019
MOQ：10 pcs
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Thickness 0.2mm Gold Plated Molybdenum Copper Heat Sink For Microwave Packages
Molybdenum Copper

Thickness 0.2mm Gold Plated Molybdenum Copper Heat Sink For Microwave Packages
Model：HCMC019
MOQ：10 pcs
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Light Weight Molybdenum Copper Heat Transfer For Sensitive Electronic Components
Molybdenum Copper

Light Weight Molybdenum Copper Heat Transfer For Sensitive Electronic Components
Model：HCMC015
MOQ：10 pcs
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Light Weight Molybdenum Copper Heat Transfer For Sensitive Electronic Components
Molybdenum Copper

Light Weight Molybdenum Copper Heat Transfer For Sensitive Electronic Components
Model：HCMC015
MOQ：10 pcs
Contact Now
Accurate Tolerance Ag Plate High Thermal Conductivity 70MoCu For IGBT In EV / HEV Industry
Molybdenum Copper

Accurate Tolerance Ag Plate High Thermal Conductivity 70MoCu For IGBT In EV / HEV Industry
Model：HCMC020
MOQ：10 pcs
Contact Now
Accurate Tolerance Ag Plate High Thermal Conductivity 70MoCu For IGBT In EV / HEV Industry
Molybdenum Copper

Accurate Tolerance Ag Plate High Thermal Conductivity 70MoCu For IGBT In EV / HEV Industry
Model：HCMC020
MOQ：10 pcs
Contact Now
Strict Dimension Control 80Mo20Cu For Radar System In Telecommunication
Molybdenum Copper

Strict Dimension Control 80Mo20Cu For Radar System In Telecommunication
Model：HCMC018
MOQ：10 pcs
Contact Now
Strict Dimension Control 80Mo20Cu For Radar System In Telecommunication
Molybdenum Copper

Strict Dimension Control 80Mo20Cu For Radar System In Telecommunication
Model：HCMC018
MOQ：10 pcs
Contact Now
Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices
Molybdenum Copper

Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices
Model：HCMC016
MOQ：10 pcs
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Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices
Molybdenum Copper

Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices
Model：HCMC016
MOQ：10 pcs
Contact Now
Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors
Molybdenum Copper

Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors
Model：HCMC013
MOQ：10 pcs
Contact Now
Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors
Molybdenum Copper

Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors
Model：HCMC013
MOQ：10 pcs
Contact Now
High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology
Molybdenum Copper

High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology
Model：HCMC012
MOQ：10pcs
Contact Now
High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology
Molybdenum Copper

High Power Semiconductor Molybdenum Copper Heatsinks State Of Art Powder Metal Technology
Model：HCMC012
MOQ：10pcs
Contact Now
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