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High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages
High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages
High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages
High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages
Specifications
Brand Name :
JBNR
Model Number :
HCCP001
Certification :
ISO9001
Place of Origin :
China
MOQ :
Negotiation
Payment Terms :
D/P,L/C, T/T, Western Union
Supply Ability :
5ton per month
Packaging Details :
Wooden packages
Material :
CPC111, CPC232, CPC141, CPC300
Surface :
Polished, Shiny, Good surface roughness
Plating :
Nickel or gold plating
Offer :
Plate, sheet, fabricated parts
Price :
Negotiable
Description

Excellent CTE High TC No Voids Of CPC Heat Spreader For Hermetic Packages

Description:

Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.

Product Properties:

Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
CPC141 9.5 7.3 280(XY)/170(Z)

Application:

Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.

High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages

Related Products:

We also offer tungsten copper heat sink (WCu), molybdenum copper (MoCu), copper molybdenum copper (Cu/Mo/Cu), copper molybdenum copper copper (Cu/MoCu/Cu) sheets or fabricated parts for microelectronics packaging and power devices.

Product tags

heat exchanger tube material selection

,

heat exchanger material selection

,

thermoforming blister packaging
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High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages

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Product Detail
Brand Name :
JBNR
Model Number :
HCCP001
Certification :
ISO9001
Place of Origin :
China
MOQ :
Negotiation
Payment Terms :
D/P,L/C, T/T, Western Union
Contact Supplier
High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages
High TC No Voids Of CPC Hermetic Packages Electronics Heat Spreader For Hermetic Packages

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
7 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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