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Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices
Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices
Specifications
Brand Name :
JBNR
Model Number :
HCMC016
Certification :
ISO9001
Place of Origin :
China
MOQ :
10 pcs
Price :
Negotiable
Payment Terms :
L/C, D/A, D/P, T/T, Western Union
Supply Ability :
5 tons a month
Delivery Time :
20 days
Packaging Details :
Wooden boxes
Grade: :
Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50
Surface: :
Low surface roughness
Dimensions: :
Based on customer requirements
Plating: :
Nickel plating and gold plaing
Shape: :
Shims or sheets or fabricated parts
Properties: :
Tailored thermal conductivity and thermal expansions
Description

Molybdenum Copper Carrier With Lower Thermal Conductivity And A Wider CTE Range For GaN Devices

Description:

Molybdenum copper heat sink is one of the heat spreader materials.

It has been frequently chosen by engineers for its cost and quality ratio. It has good thermal conductivity and wide thermal expansion.

Compared with other materials, it has good machineability.

We can offer 85MoCu to 50MoCu sheets, machined parts, or stamped parts, wire cutting parts.

And based on different application, we can offer plating based on your requirements. After plating, we will ensure your have a good welding condition.

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
85MoCu 85±2% 10.01 7 200(25℃)/156(100℃)
80MoCu 80±2% 9.9 7 170(25℃)/190(100℃)
70MoCu 70±2% 9.8 7.3 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 8.4 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)


Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product tags

aluminum nitride thermal conductivity

,

molybdenum thermal conductivity

,

fr4 pcb thermal conductivity
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Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices

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Product Detail
Brand Name :
JBNR
Model Number :
HCMC016
Certification :
ISO9001
Place of Origin :
China
MOQ :
10 pcs
Price :
Negotiable
Contact Supplier
Lower Thermal Conductivity Molybdenum Copper Carrier Wider CTE Range For GaN Devices

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
7 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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