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Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors
Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors
Specifications
Brand Name :
JBNR
Model Number :
HCMC013
Certification :
ISO9001
Place of Origin :
China
MOQ :
10 pcs
Price :
Negotiable
Payment Terms :
L/C, D/A, D/P, T/T, Western Union
Supply Ability :
5 tons a month
Delivery Time :
20 days
Packaging Details :
Wooden boxes
Grade: :
Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50
Surface: :
Low surface roughness
Dimensions: :
Based on customer requirements
Plating: :
Nickel plating and gold plaing
Shape: :
Shims or sheets or fabricated parts
Description

Ultra-pure Low Density Heat Dissipating Mo/cu Laminates In High-power Transistors

Description:

Consisting of ultra-pure molybdenum with OFC in 30% weight,molybdenum copper composite has the properties of higher thermal conductivity and lower density compared with pure molybdenum. Nowadays the electronic components is getting smaller and also requires greater power densities.

By using our moly copper carriers, you could receive efficent cooling effect and outstanding service life.

What we can offer:

1. With years of powder metalurgy experience, we can make very even grain size. And the material has no pores in inner structure.

This can ensure the material has good hermeticity.

2. For different materials, we have ways of surface dealing to make sure the surface is good for your own plating.

3. We can offer all kinds of plating, including nickel plating, gold plating or Ag plating. If you wanna your carriers to be plated, you can let us know.

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product tags

high thermal conductivity pcb

,

thermal conductivity of fr4 pcb

,

fr4 pcb thermal conductivity
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Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors

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Product Detail
Brand Name :
JBNR
Model Number :
HCMC013
Certification :
ISO9001
Place of Origin :
China
MOQ :
10 pcs
Price :
Negotiable
Contact Supplier
Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
7 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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