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Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials
Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials
Specifications
Brand Name :
JBNR
Model Number :
50WCu,60WCu,70WCu,85WCu
Place of Origin :
CHINA
MOQ :
Negotiation
Price :
Negotiable
Payment Terms :
L/C, , T/T, Western Union
Supply Ability :
1000000pcs per month
Delivery Time :
25days
Packaging Details :
as customer required
Material :
tungsten copper
Density :
16.4
CTE :
7.2
TC :
180-190
Brand :
JBNR
Application :
Electronic Packaging
Description

Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper Molybdenum Electronic Packaging Materials

Description:

Copper Tungsten are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Advantages:
1. High thermal conductivity
2. Excellent hermeticity
3. Stampable sheets available
4. Semi-finished or finished (Ni/Au/Ag/NiPd/Au plated) products available
5. Low void

Product Properties:

Grade W Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃) / 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.

Product picture:

Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

Product tags

aluminium package

,

packaging aluminium

,

metallographic consumables
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Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

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Product Detail
Brand Name :
JBNR
Model Number :
50WCu,60WCu,70WCu,85WCu
Place of Origin :
CHINA
MOQ :
Negotiation
Price :
Negotiable
Payment Terms :
L/C, , T/T, Western Union
Contact Supplier
Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
7 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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