MachineU > China Products > Minerals & Metallurgy > Non-ferrous Metal > Molybdenum
Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Specifications
Brand Name :
JBNR
Model Number :
HCMC024
Certification :
ISO9001
Place of Origin :
China
MOQ :
10pcs
Price :
Negotiable
Payment Terms :
L/C, D/A, D/P, T/T, Western Union
Supply Ability :
5 tons a month
Delivery Time :
15-20 days
Packaging Details :
Wooden boxes
Grade: :
Mo85Cu15, Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50
Surface: :
Grinded or lathed
Dimensions: :
Based on customer requirements
Plating: :
Nickel plating or gold plaing
Shape: :
Shims or sheets or fabricated parts
Other: :
If required, we can offer silver plating
Description

Thermal Buffer Molybdenum Copper Substrate Welded To DBC On Chip

Description:

With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Heat sink (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.

For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.

Customers normally choose moly copper as heat sink and then they will weld DBC onto the heat sink.

Advantages:

1. high thermal conductivity and excellent hermeticity.

2. 40% lighter weight compared to WCu materials.

Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
85MoCu 85±2% 10.01 7 200(25℃)/156(100℃)
80MoCu 80±2% 9.9 7 170(25℃)/190(100℃)
70MoCu 70±2% 9.8 7.3 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 8.4 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product tags

steel plate thickness tolerance

,

flatness tolerance for steel plate

,

steel plate flatness tolerance
Send your message to this supplier
Send Now

Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

Ask Latest Price
Product Detail
Brand Name :
JBNR
Model Number :
HCMC024
Certification :
ISO9001
Place of Origin :
China
MOQ :
10pcs
Price :
Negotiable
Contact Supplier
Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip
Thermal Buffer Molybdenum Copper Alloy Substrate Welded To DBC On Chip

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
7 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Molybdenum Copper
MachineU China Products Minerals & Metallurgy Non-ferrous Metal Molybdenum
Contact Supplier
Submit Requirement