| | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. |
| Board thickness Mass production | 394mil(10mm) Samples: 17.5mm. |
| | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger. |
| | 1150mm × 560mm |
| | Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers. |
| | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| | X-ray, AOI Test, Functional Test |
| | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
| | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers. |
| | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
| | 5Million Points/Day |
| | 0.35Million Points/Day |
| | 94v-0,CE,SGS,FCC,RoHS,ISO9001. |