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| Professional Surface-mounting and Through-hole soldering technology |
Various sizes like 1206,0805,0603 components SMT technology |
ICT(In Circuit Test),FCT(Functional Circuit Test) |
PCB Assembly With UL,CE,FCC,Rohs Approval |
Nitrogen gas reflow soldering technology for SMT. |
High Standard SMT&Solder Assembly Line |
High density interconnected board placement technology capacity. |
Components | Passive Down to 0201 size |
BGA and VFBGA |
Leadless Chip Carriers/CSP |
Double-sided SMT Assembly |
Fine Pitch to 0.8mils |
BGA Repair and Reball |
Part Removal and Replacement |
Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized |
Type of Assembly | SMT, Thru-hole |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Bare Board Size | Smallest:0.25*0.25 inches |
Largest:20*20 inches |
File Formate | Gerber files, Pick-N-Place file, Bill of Materials |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection AOI Test |
PCB assembly process | Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing |