Hot Sales FPC flexible pcb circuit board manufacturing services factory for electronic parts Service Manufacturers
FPC Production Capability
Item | Flex PCB |
Material | PI, PET |
Layers | 1-12 |
Base Copper Thickness | 1/4-2OZ |
Board Thickness(Min.) | Single-sided | 0.05mm |
Double-sided | 0.10mm |
Board Dimension(Max.) | 500mm*1000mm |
| Copper Weight: up to 0.2OZ | 0.04mm |
Copper Weight: up to 0.5OZ | 0.06mm |
Copper Weight: 0.5-1OZ | 0.075mm |
Copper Weight: over 1OZ | 0.10mm |
Via Type | Through Hole, Blind, Buried |
Silkscreen Width/Space(Min.) | 0.10mm |
Solder Mask Bridge(Min.) | 0.2mm for coverlay, 0.12mm for LPI |
Hole(Min.) | Drill | 0.15mm |
| Punching | 0.5mm |
Slot(Min.) | 0.5mm(Punching), 0.8mm(Routing) |
Dimension Tolerance | Line Width | ±0.03mm(W≤0.3mm), ±10%(W>0.3mm) |
Hole | ±0.05mm(NPTH) |
±0.075mm(PTH) |
Outline | ±0.10mm, Special±0.05mm with high-precise hard tool |
Conductor to Outline | ±0.10mm, Special±0.05mm with high-precise hard tool |
Surface Treatment | Ni/Au Plating | Ni: 2-8um(80-320u") Au: 0.05-2um(2-80u") |
ENIG | Ni: 2-6um(80-240u") Au: 0.05-0.10um(2-4u") |
Tin Plating | 5-20um |
Immersion Silver | 0.2-0.4um |
Immersion Tin | 1um(Min.) |
OSP | 0.2um(Min.) |
Hard Gold | Hardness over 150HV |
Others | Gold Plating+ENIG; ENIG+OSP; ENPIG |
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