Brief introduction:

Series F metal circular connectors in many size and outer diameter for different applications are designed to be compatible with Odu connector Series F which with Metal half-shell alignment for easy operations.

Product details:

1. Shell size 0 to size 3;

2. Multi-pole types 2 to 16 contacts

3. Locking with Conical Sleeve - FP-Locking Conception

4. Metal half-shell alignment with several coding options

5. Solder ,print or crimp contacts (straight or elbow)

6. High packing density for space saving

7. 360 angle screening for full EMC shielding;

8. water-tight or vacuum-tight socket;

9. Watertight connection（IP50-68）;

10. Heavy-duty metal housings, matte or black chromate finish;

11. PPS insulation bodies for autoclaving available;

12. Compatible with Odu Series F, such as:

S10F1C-P02MFD0-52ES S10F1C-P03MFD0-52ES S10F1C-P04MFD0-52ES S10F1C-P05MFD0-52ES

S10F2C-P02MFD0-52ES S10F2C-P03MFD0-52ES S10F2C-P04MFD0-52ES S10F2C-P05MFD0-52ES

S11F1C-P02MFD0-52ES S11F1C-P03MFD0-52ES S11F1C-P04MFD0-52ES S11F1C-P05MFD0-52ES

S11F2C-P02MFD0-52ES S11F2C-P03MFD0-52ES S11F2C-P04MFD0-52ES S11F2C-P05MFD0-52ES

S20F1C-P02MFD0-52ES S20F1C-P03MFD0-52ES S20F1C-P04MFD0-52ES S20F1C-P05MFD0-52ES

S20F2C-P02MFD0-52ES S20F2C-P03MFD0-52ES S20F2C-P04MFD0-52ES S20F2C-P05MFD0-52ES

S21F1C-P02MFD0-52ES S21F1C-P03MFD0-52ES S21F1C-P04MFD0-52ES S21F1C-P05MFD0-52ES

S21F2C-P02MFD0-52ES S21F2C-P03MFD0-52ES S21F2C-P04MFD0-52ES S21F2C-P05MFD0-52ES

G50F1C-T02LFD0-0000 G50F1C-T03LFD0-0000 G50F1C-T04LFD0-0000 G50F1C-T05LFD0-0000

G50F2C-T02LFD0-0000 G50F2C-T03LFD0-0000 G50F2C-T04LFD0-0000 G50F2C-T05LFD0-0000

G51F2C-T02LFD0-0000 G51F2C-T03LFD0-0000 G51F2C-T04LFD0-0000 G51F2C-T05LFD0-0000

G80F1C-T02LFD0-0000 G80F1C-T03LFD0-0000 G80F1C-T04LFD0-0000 G80F1C-T05LFD0-0000

G80F2C-T02LFD0-0000 G80F2C-T03LFD0-0000 G80F2C-T04LFD0-0000 G80F2C-T05LFD0-0000

G81F2C-T02LFD0-0000 G81F2C-T03LFD0-0000 G81F2C-T04LFD0-0000 G81F2C-T05LFD0-0000

Application:

HIMO''s high quality connectors are found in a variety of challenging applications and environments including: Automotive, Audio-video, Aviation, Communications, Industrial Control, Information Systems, and Machines, Medical, Military, Test and Measurement, Data Acquisition, Data Transfer Equipment. Module Power, Sensor, Sensor Systems Instrumentation, Analysis Application.