HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified Supplier
5 Years
shenzhen
Since 2010
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Supplier Homepage > Products > IC Package Substrate

PRODUCT CATEGORIES

BGA Substrate

 (25)

IC Package Substrate

 (47)

Sip Package Substrate

 (3)

FCCSP Package Substrate

 (8)

Sensors Substrate

 (3)

RF Module Substrate

 (2)

Memory Substrate

 (21)

MEMS Substrate

 (3)

IoT Substrate

 (3)

Other Ultrathin Substrate

 (8)

Ultrathin Rigid PCB

 (16)

Medical Equipment PCB

 (1)
Product Categories

IC Package Substrate

47
Choose from our ic package substrate products, find out more, and feel free to inquiry us
Hitachi BT IC Package Substrate production supporting
Hot selling!
IC Package Substrate

Hitachi BT IC Package Substrate production supporting
Supply Ability：30000 square meters per month
MOQ：1 square meter
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AUS308 PSR IC Package substrate manufacture
Hot selling!
IC Package Substrate

AUS308 PSR IC Package substrate manufacture
Supply Ability：30000sqm/ month
MOQ：1000pieces
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Precision 0.15mm IC Packaging Substrate fabrication
Hot selling!
IC Package Substrate

Precision 0.15mm IC Packaging Substrate fabrication
Model：NC-02
MOQ：1000pieces
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0.15mm IC assembly package substrate For semiconductor package
IC Package Substrate

0.15mm IC assembly package substrate For semiconductor package
Supply Ability：30000 square meters per month
MOQ：1000pieces
Contact Now
Hitachi brand BT material substrate manufacture
IC Package Substrate

Hitachi brand BT material substrate manufacture
Model：NC-02
MOQ：1000pieces
Contact Now
4L build up types 0.8mm Gold Surface IC Package Substrate
IC Package Substrate

4L build up types 0.8mm Gold Surface IC Package Substrate
Supply Ability：30000 square meters per month
MOQ：1 square meter
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Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation
IC Package Substrate

Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation
Supply Ability：30000 square meters per month
MOQ：1 square meter
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Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR
IC Package Substrate

Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR
Supply Ability：8000 square meters per month
MOQ：1 square meter
Contact Now
JEDEC Standard eMCP IC Package Substrate Fabrication
IC Package Substrate

JEDEC Standard eMCP IC Package Substrate Fabrication
Supply Ability：30000 square meters per month
MOQ：1 square meter
Contact Now
FCBGA/BGA package substrate manufacture
IC Package Substrate

FCBGA/BGA package substrate manufacture
Model：HRX
MOQ：1 square meter
Contact Now
MEMS package substrate manufacture
IC Package Substrate

MEMS package substrate manufacture
Model：HRX
MOQ：1 square meter
Contact Now
High-Performance SiP Package Substrate for IoT Electronics
IC Package Substrate

High-Performance SiP Package Substrate for IoT Electronics
Model：HRX
MOQ：1 square meter
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FCCSP Flipchip package substrate manufacture
IC Package Substrate

FCCSP Flipchip package substrate manufacture
Model：HRX
MOQ：1 square meter
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memory IC substrate manufacture for DDR/LPDDR
IC Package Substrate

memory IC substrate manufacture for DDR/LPDDR
Model：HRX
MOQ：1 square meter
Contact Now
semiconductor FCCSP package substrate manufacture in HOREXS
IC Package Substrate

semiconductor FCCSP package substrate manufacture in HOREXS
Model：HRX
MOQ：1 square meter
Contact Now
FCBGA/BGA package substrate manufacture
IC Package Substrate

FCBGA/BGA package substrate manufacture
Model：HRX
MOQ：1 square meter
Contact Now
Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
IC Package Substrate

Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
Supply Ability：30000 square meters per month
MOQ：1 square meter
Contact Now
Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip
IC Package Substrate

Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip
Supply Ability：30000 square meters per month
MOQ：1 square meter
Contact Now
Precision 0.15mm IC Package Substrate Fabrication V2 Flame Retardant
IC Package Substrate

Precision 0.15mm IC Package Substrate Fabrication V2 Flame Retardant
Model：NC-02
MOQ：1000pieces
Contact Now
EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material
IC Package Substrate

EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material
Supply Ability：8000 square meters per month
MOQ：1 square meter
Contact Now
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