Specifications
Brand Name :
Horexs
Certification :
UL
Place of Origin :
china
MOQ :
1000pieces
Price :
US 0.1-0.12 each piece
Payment Terms :
L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability :
30000 square meters per month
Delivery Time :
7-10 working days
Packaging Details :
carton customized
type :
IC substrate
dielectric layer :
TR-4
Material :
BT
flame retardant properties :
V2
Mechanical rigid :
rigid
Processing technic :
Electrolytic foil
transport package :
carton
Description

Application:IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage;

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.29mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:4 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK)

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer substrates,please also provide us layer stack-up information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality substrate ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

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0.15mm IC assembly package substrate For semiconductor package

Ask Latest Price
Brand Name :
Horexs
Certification :
UL
Place of Origin :
china
MOQ :
1000pieces
Price :
US 0.1-0.12 each piece
Payment Terms :
L/C, D/P, T/T, Western Union, MoneyGram
Contact Supplier
0.15mm IC assembly package substrate For semiconductor package
0.15mm IC assembly package substrate For semiconductor package

HongRuiXing (Hubei) Electronics Co.,Ltd.

Verified Supplier
5 Years
shenzhen
Since 2010
Business Type :
Manufacturer
Total Annual :
50million-100million
Employee Number :
100~200
Certification Level :
Verified Supplier
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