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HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified Supplier
5
Years
shenzhen
Since 2010
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BGA Substrate
IC Package Substrate
Sip Package Substrate
FCCSP Package Substrate
Sensors Substrate
RF Module Substrate
Memory Substrate
MEMS Substrate
IoT Substrate
Other Ultrathin Substrate
Ultrathin Rigid PCB
Medical Equipment PCB
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Products Categories
BGA Substrate
(25)
IC Package Substrate
(47)
Sip Package Substrate
(3)
FCCSP Package Substrate
(8)
Sensors Substrate
(3)
RF Module Substrate
(2)
Memory Substrate
(21)
MEMS Substrate
(3)
IoT Substrate
(3)
Other Ultrathin Substrate
(8)
Ultrathin Rigid PCB
(16)
Medical Equipment PCB
(1)
Company Profile
Quality Control
Contact Us
Menu
Supplier homepage
Product categories
Show all products
BGA Substrate
IC Package Substrate
Sip Package Substrate
FCCSP Package Substrate
Sensors Substrate
RF Module Substrate
Memory Substrate
MEMS Substrate
IoT Substrate
Other Ultrathin Substrate
Ultrathin Rigid PCB
Medical Equipment PCB
Company profile
Quality control
Contact us
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Sip Package Substrate
PRODUCT CATEGORIES
BGA Substrate
(25)
IC Package Substrate
(47)
Sip Package Substrate
(3)
FCCSP Package Substrate
(8)
Sensors Substrate
(3)
RF Module Substrate
(2)
Memory Substrate
(21)
MEMS Substrate
(3)
IoT Substrate
(3)
Other Ultrathin Substrate
(8)
Ultrathin Rigid PCB
(16)
Medical Equipment PCB
(1)
Product Categories
Sip Package Substrate
3
Choose from our sip package substrate products, find out more, and feel free to inquiry us
Hot selling!
Sip Package Substrate
Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
Supply Ability:
30000 square meters per month
MOQ:
1 square meter
Contact Now
Hot selling!
Sip Package Substrate
Sip package substrate BT material 4 layer ENEPIG
Supply Ability:
30000 square meters per month
MOQ:
1 square meter
Contact Now
Hot selling!
Sip Package Substrate
Anylayer/Buildup types Sip packaging Substrate manufacture
Supply Ability:
30000 square meters per month
MOQ:
1 square meter
Contact Now
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