0.18mm thick 48cm wide double sided transparent EAA/PO hot melt self adhesive film for embroidery patch
Self Adhesive Film Description:
This product is a self-adhesive hot melt film. Double layer structure: the first layer is hot melt adhesive (no viscosity under normal temperature, need to be heated), and the other layer is acrylic acid pressure sensitive adhesive (in normal temperature, there is self-adhesive energy and the entrusted off-type paper).Self-adhesive level can be no less than 150 degree temperature, not lose the glue, and also can be paste repeatedly, in line with the European demand index.
Self Adhesive Film Composition:
Ethylene acrylic acid copolymer
Self Adhesive Film Applications:
DS019YM development direction and application is mainly applicable to the embroidery trademark, LOGO class or need to cut after the positioning of hot pressing.
Conventional thickness* width*length:
0.18mm*48cm*100yards
Packaging Details:
1PC/PE FILM, 100yard/roll, 2 rolls/CTN, or it's up on the customer's option
Delivery Detail:
Shipped in 3-15 days after payment
Physical Characteristics:
Color | transparent | Release liner | Glassine release paper |
Density | 1.2±0.02g/cm³ | Conventional Thickness | 0.08mm (hot melt 0.08mm+acrylics 0.1mm) |
Melting point | 90℃ | Width | 6mm-1000mm |
Operating Temperature | 120℃-140℃ | Conventional Width | 480mm |
Melt Flow Index | 300±10g/10min ; Condition:ASTMD1238-04 | Length | 100 yards |
Washing Resistant Time | 40°C/72H | Finished Products Specification | 480mm(width)*100yards(length)/roll |
Recommended Bonding Conditions:
Flat Press: |
Machine Setting: 120℃-140℃ |
Dwell Time: 5-15 seconds |
Pressure: 0.3-0.6mpa |
1, Bonding temperature and pressure as well as the time involved in the strength of the film to material. Bonding temperature must be close to the machine set the temperature, the pressure must be uniform, mold and pressure roller must be flat.
2, In different machinery and materials, the bonding conditions used will be different. The conditions marked here are only basic. The optimum bonding conditions should be made by creating suitable construction conditions for the particular application damage, direct or consequential, arising out of the use, misuse or inability to use the product.