Polyamide Hot Melt Glue Powder For Textile Heat Transfer Printing
Polyamide Hot Melt Glue Powder Adhesive For Textile Heat Transfer
Polyamide Powder Product Description
The product is thermoplastic copolyamide powder hot melt adhesive.
This product is a big structure copolyamide hot melt adhesive, better than the same type of nylon hot melt adhesive bonding strength; It has high strength adhesion to textile category. Can be washed at high temperature, dry cleaning performance is excellent, and suitable for enzyme washing and ordinary enzyme washing
Polyamide Powder Physical Characteristics:
Property | Criterion |
Keywords | Polyamide Powder |
Appearance | White powder |
Density ASTM D-792 | 1.10±0.02 g/cm³ |
Melt Point DSC | 125-134 ℃ |
Melt Index ASTM D-1238 | 30±3g/10min |
Powder size range | 0-80μm,80μm-170 μm |
Polyamide Powder Technical Parameters:
Bonding Parameters ( reference only) | Temperature | 140-150℃ |
| Press | 3.0 kg/cm2 |
| Time | 14 S |
Washing Resistance | 40℃ | Excellent |
| 60℃ | Good |
| 90℃ | General |
Dry cleaning resistance | Excellent | |
Resistant to enzyme washing | Excellent | |
Resistance to enzyme washing | Good |
Polyamide Powder Application:
ES213 is used in textiles and garments, automotive interiors, filters, shoe materials, heat transfer pastes, flocking pastes, and bronzing pastes.
FAQ:
Q1) . How about your conventional package and the MOQ of your adhesive powder?
We have 1kg,20kg and 25kg per bag,MOQ is 20kg or 25kg
Q2) . What type of hot melt adhesive powder do you have??
We have PA, TPU, EVA and PES hot melt adhesive powder.We can accord your application to give your suitable type.
Q3). Do you provide free sample? And how many days it will take?
Yes, we can provide 0.3-0.5kg free sample, only need you to pay the shipping cost. We will make the sample within 1- 2 working days and it will take 3-7days on the transportation.
Q4). What is your lead time ?
2-7 days , depending on the quantity
Q5). How do I pay for my order?
We accept T/T , Paypal and alibaba trade assurance order.