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120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application
120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application
120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application
120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application
120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application
120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application
Specifications
Brand Name :
HSF
Model Number :
120DG-DS1030-LPE
Place of Origin :
China
MOQ :
10000㎡
Payment Terms :
T/T, L/C
Supply Ability :
80000kg per week
Delivery Time :
within 10 days
Packaging Details :
PE wrapping film + Bubble Film + Wooden pallet (Standard 1100mm x 1100mm x 100mm)
Material :
Low Density Polyethylene
Color :
Dark Green, customized
Halogen free :
Yes
Thickness :
120 ± 5μm, customized
Width :
1300 -0 ~ +6mm, customized
Core :
3" or 6"
Coating :
Double Side UV Cured Silicone Coating
Release Force :
Side A 5-10gf, Side B 20-30gf, the ratio of release force can be customized
Subsequent Adhesion Rate :
≥75%
Length :
1800m ± 200m, customized
Splice :
≤1
Sample :
A4 sheet for free
Description

LDPE Release Film, D, 120micron, DG, UV Cured, Application of Tape, Sealing strip, No solvent or silicone transfer.

1 Appearance No air bubbles / stains / breakage / impurities Measured data (Ref.)
2 Size Width (mm) 1000 -0+6 1004
Thickness (mm) 0.120 ± 8% 0.116
3 Max. Tension (N / 50mm) TD ≥ 15 20
MD ≥ 15 21
4 Color difference Colorimeter △E ＜ 3 ok
5 Elongation @ break (%) TD ≥ 230 876
MD ≥ 230 754
6 Surface Tension (Corona treatment) Dyne Value ≥42 dyne 48
7 Release Force (gf/25mm 20min.Finat 10) Inner 5-10 7
Outer 20-30 24
8 Subsequent Adhesion (%) Inner ≥75 88
Outer ≥75 90
9 Winding direction Customized -
10 Splice No. ≤1 -

LDPE (high pressure low density polyethylene):

Non-toxic, tasteless, odorless, translucent spherical or cylindrical particles, excellent low temperature resistance.

chemical resistance, good extensibility, electrical insulation, but poor wetness, Flammable.

Density: 0.910—0.9408G/CM3 (g/cm3), suitable for extrusion, blister, injection molding, vacuum, molding, and conversion

molding and other processing methods. The crystallinity is 55-65%, and the crystal melting point is 108-126 °C.

120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application

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120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application

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Product Detail
Brand Name :
HSF
Model Number :
120DG-DS1030-LPE
Place of Origin :
China
MOQ :
10000㎡
Payment Terms :
T/T, L/C
Supply Ability :
80000kg per week
Contact Supplier
120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application
120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application
120 μm Low Density Film UV Cured No Solvent No Silicone Transfer No Residuals mainly for Tape application

SUZHOU HSF ELECTRONIC MATERIALS TECHNOLOGY CO., LTD.

Verified Supplier
3 Years
jiangsu, suzhou
Since 2018
Business Type :
Manufacturer, Importer, Exporter
Main Products :
Polyester Release Film, Non Silicone Release Film, HDPE Film
Total Annual :
15million-18million
Employee Number :
50~100
Certification Level :
Verified Supplier
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