FSMD005-1206-R Surface Mountable PTC Resettable Fuse F SMD1206 Series 0.05A FUZETEC Taiwan
1. Summary
(a) RoHS Compliant & Halogen Free
(b) Applications: All high-density boards
(c) Product Features: Small surface mountable, Solid state, Faster time to trip than
standard SMD devices, Lower resistance than standard SMD devices
(d) Operation Current: 0.05A~2.0A
(e) Maximum Voltage: 6V~60VDC
(f) Temperature Range : -40℃ to 85℃
2. Agency Recognition
UL : File No. E211981
C-UL: File No. E211981
TÜ V: File No. R50090556
3. Material Specification
Terminal pad material: Pure Tin
Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
4. Solder reflow
※ Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone
is higher than those for Regular. This may cause damage to other components.
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Envorinment : < 30℃ / 60%RH
5. Caution:
1. If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
2. Devices are not designed to be wave soldered to the bottom side of the board.
Deli electronics tehcnology Co.,Ltd.
www.icmemorychip.com
www.deli-ic.com
Email:sales3@deli-ic.com
Skype:hkdeli881
Contact: VIVI-CHEN