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XCKU3P-L1FFVD900I Programmable Logic Array IC 304 31641600 355950 900-BBGA FCBGA
XCKU3P-L1FFVD900I Programmable Logic Array IC 304 31641600 355950 900-BBGA FCBGA
Specifications
Brand Name :
Xilinx
Model Number :
XCKU3P-L1FFVD900I
MOQ :
50pcs
Price :
Negotiable
Supply Ability :
1000000pcs
Number of Logic Elements :
355950 LE
Number of I/Os :
304 I/O
Data Rate :
32.75 Gb/s
Number of Transceivers :
16 Transceiver
Mounting Style :
SMD/SMT
Package / Case :
FBGA-900
Brand :
Xilinx
Description

XCKU3P-L1FFVD900I Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 304 31641600 355950 900-BBGA, FCBGA

Xilinx Kintex® UltraScale+™ FPGAs

Xilinx Kintex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Kintex UltraScale+ devices are ideal for both packet processing and DSP-intensive functions, and for applications ranging from wireless MIMO technology to Nx100G networking and data center.

FEATURES

  • Programmable system integration
    • Up to 1.2M System Logic Cells
    • UltraRAM for on-chip memory integration
    • Integrated 100G Ethernet MAC with RS-FEC and 150G Interlaken cores
  • Increased system performance
    • 6.3 TeraMACs of DSP compute performance
    • Over 2X system-level performance per watt over Kintex-7 FPGAs
    • 16G and 28G backplane-capable transceivers
    • 2666 Mb/s DDR4 in the mid-speed grade
  • BOM cost reduction
    • 12.5Gb/s transceivers in slowest speed grade
    • VCXO and fractional PLL integration reduces clocking component cost
  • Total power reduction
    • Up to 60% lower power vs. 7 series FPGAs
    • Voltage scaling options for performance and power
    • Tighter logic cell packing reduces dynamic power
  • Accelerated design productivity
    • Co-optimized with Vivado Design Suite for rapid design closure
    • SmartConnect technology for intelligent IP integration

APPLICATIONS

  • 112MHz point-to-point MWR modem and packet processing
  • 1GHz eBand modem and packet processing
Product tags

hi1101 ic chip

,

ic tda2822m

,

74HC283DB
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XCKU3P-L1FFVD900I Programmable Logic Array IC 304 31641600 355950 900-BBGA FCBGA

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Product Detail
Brand Name :
Xilinx
Model Number :
XCKU3P-L1FFVD900I
MOQ :
50pcs
Price :
Negotiable
Supply Ability :
1000000pcs
Number of Logic Elements :
355950 LE
Contact Supplier
XCKU3P-L1FFVD900I Programmable Logic Array IC 304 31641600 355950 900-BBGA FCBGA

HongKong Wei Ya Hua Electronic Technology Co.,Limited

Verified Supplier
3 Years
shenzhen
Since 2019
Business Type :
Distributor/Wholesaler
Main Products :
Integrated Circuits ICs, Programmable Logic ICs, Zener Diode IC
Total Annual :
3000000-5000000
Employee Number :
10~50
Certification Level :
Verified Supplier
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