Specifications
Category :
Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number :
M2S060
Product Status :
Active
Peripherals :
DDR, PCIe, SERDES
Primary Attributes :
FPGA - 60K Logic Modules
Series :
Automotive, AEC-Q100, SmartFusion®2
Package :
Tray
Mfr :
Microchip Technology
Supplier Device Package :
676-FBGA (27x27)
Connectivity :
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature :
-40°C ~ 125°C (TJ)
Architecture :
MCU, FPGA
Package / Case :
676-BGA
Number of I/O :
387
RAM Size :
64KB
Speed :
166MHz
Core Processor :
ARM® Cortex®-M3
Flash Size :
256KB
Description :
IC SOC CORTEX-M3 166MHZ 676FBGA
Description
ARM® Cortex®-M3 System On Chip (SOC) IC Automotive, AEC-Q100, SmartFusion®2 FPGA - 60K Logic Modules 166MHz 676-FBGA (27x27)
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M2S060TS-1FGG676T2

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Category :
Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number :
M2S060
Product Status :
Active
Peripherals :
DDR, PCIe, SERDES
Primary Attributes :
FPGA - 60K Logic Modules
Series :
Automotive, AEC-Q100, SmartFusion®2
Contact Supplier
M2S060TS-1FGG676T2

ZhongHao Industry Limited

Verified Supplier
2 Years
shenzhen
Business Type :
Manufacturer, Seller
Certification Level :
Verified Supplier
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