ICM-20648 ELECTRONIC INTEGRATED CIRCUITS IMU-Inertial Measurement Unit DMP-Enabled 6-Axis Integrated Solution for

1.APPLICATIONS
•Wearable Devices
•Smartphones and Tablets
•IoT Applications
•Motion-based game controllers
•3D remote controls for Internet connected DTVs and set top boxes, 3D mice

2.GENERAL DESCRIPTION
The ICM-20648 is a 6-axis MotionTracking device that is ideally suited for Smartphones, Tablets, Wearable Sensors, and general IoT applications.
•3-axis gyroscope, 3-axis accelerometer, and a Digital Motion Processor™ (DMPTM) in a 3x3x0.9mm (24-pin QFN) package
•Step Count, Activity Classifier, and B2S (Bring-to-See) Gesture tuned for Wrist Worn Wearable Applications
•DMP offloads computation of motion processing algorithms from the host processor, improving system power performance
•Software drivers are fully compliant with Google’s latest Android release
•Enhanced FSYNC functionality to improve timing for applications like EIS

ICM-20648 supports an auxiliary I2C interface to external sensors, on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and programmable interrupts. The device features an operating voltage range down to 1.71V. Communication ports include I2C and high speed SPI at 7 MHz.

3.FEATURES
•3-Axis Gyroscope with Programmable FSR of ±250dps, ±500dps, ±1000dps and ±2000dps
•3-Axis Accelerometer with Programmable FSR of ±2g, ±4g, ±8g and ±16g
•Onboard Digital Motion Processor (DMP)
•Android support
•SW features supported in DMPoBring to See oStep Counter oStep Detector oActivity Classifier (walk, run, bike, still) oCalibration: Accel Bias, Compass Cal, Gyro Cal oGame Rotation Vector oSignificant Motion oPick up oRotation Vector (with Aux compass) oGeoMagnetic Rotation Vector (with Aux compass) oLinear Acceleration oGravity oOrientation oTilt •Auxiliary I2C interface for external sensors
•On-Chip 16-bit ADCs and Programmable Filters
•7 MHz SPI or 400 kHz Fast Mode I²C•Digital-output temperature sensor
•VDD operating range of 1.71V to 3.6V
•MEMS structure hermetically sealed and bonded at wafer level
•RoHS and Green compliant

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