Product features:
1) Smaller pixel pitch: P0.935/ P1.25/P1.5625
2) Stronger protection: COB LED chips are welded on the PCB board directly, then do encapsulation. It has excellent protection capabilities.
3) Higher reliability and stability: COB technology has simpler process on material using and producing than SMD, so it has higher performance on heat dissipation to prolong life span.
4) Larger viewing angle: has larger viewing angle and is easy to control the loss of light refraction.
Pixeltype | 1.25mm |
LED Encapsulation | COB |
PixelConfiguration | 1R1G1B |
DrivingIC | ICN2065+ICN2018 |
FreshFrequency | ≥3840Hz |
ModuleResolution | 120*45=5400Dots |
ModuleSize | 150mm*56.25mm |
InputVoltage(DC) | 4.2V |
MaxVoltage | 1.5A |
ModuleMaxPower | 6.5W |
Drivingmethod | 1/45 |
Horizontalviewingangle | ≥170(±10°) |
Verticalviewingangle | ≥170(±10°) |
Brightness | 400~600CD/㎡ |
GrayLevel | >14bit |
FreshFrequency | ≥1920Hz |
CabinetResolution | 240*45/ 480*45 / 720*45 |
PixelDensity(dot/㎡) | 640000Dots/㎡ |
CabinetSize | 300*60MM / 600*60MM /900*60MM |
MTBF | ≥100000Hours |
LifeSpan | ≥50000Hours |
Pixeluncontrolledrate | 0.3‰ |
HUB | 1EA/ 1EA / 2EA |
PowerSupply | DC5VTheExternalpowersupply |
WorkCondition | INDOOR |
Temperatureoperating | -40to60℃ |
Humidityoperating | 10%to90%RH |
StorageTemperature | 0to40℃ |
StorageHumidity | 40%to60%RH |