Alloy Molded 100 One-piece Chip Power Inductor Magnetic Shielding Structure

1.Product Description

The Alloy Molded 100 Chip Power Inductor is a high - performance electronic component designed for power - intensive applications. With the "100" likely indicating a specific inductance value (such as 100 microhenries, though it could vary depending on the manufacturer's naming convention), it offers a defined inductance crucial for tasks like energy storage and filtering in power - related circuits. Its alloy - molded construction provides enhanced mechanical strength and thermal conductivity. This not only ensures the inductor can withstand harsh operating conditions but also effectively dissipates heat generated during operation, maintaining stable performance. The chip - type design allows for easy surface - mount integration onto printed circuit boards (PCBs), making it suitable for space - constrained applications, similar to modern smartphones, tablets, and compact power supplies. It is engineered to handle substantial electrical currents, meeting the power demands of various circuits and ensuring stable operation under different load conditions, playing a pivotal role in power conversion and management systems to regulate current and voltage efficiently.

1. Excellent electrical performance: with a specific inductance value, “100” probably means 100 microhenries, this precise inductance value is crucial for energy storage and filtering in power-related circuits, and can efficiently fulfill the task of guaranteeing the normal operation of the circuits. At the same time, it is designed to carry high currents to meet the power requirements of various circuits, ensure stable operation under different load conditions, and efficiently regulate current and voltage in power conversion and management systems.

2. Good physical characteristics: the alloy molded structure greatly enhances the mechanical strength, enabling it to withstand harsh working conditions and is not easily damaged; it also has excellent thermal conductivity, which can effectively dissipate the heat generated during operation, maintain stable performance, and reduce performance degradation and the risk of malfunction due to overheating.

3. High application convenience: The chip-based design facilitates surface mount integration onto printed circuit boards (PCBs), which is particularly suitable for space-constrained applications, such as modern smartphones, tablet PCs and compact power supplies. This design not only saves space, but also improves productivity and facilitates mass production and application.

2.Performance Characteristics