Plate-shaped alumina for monocrystalline silicon wafer grinding and polishing
●Specification
WCA | WCA-3 | ||
Al2O3 | % | ≥99.5 | ≥99.5 |
Original Crystal | μm | 10-20 | ~3.0 |
Density | g/cm3 | ≥0.8 | ≥0.6 |
Oil Absorption | % | ≤65 | ≤75 |
Shape | plate | ||
Application | Used for mirror finish polishing in the electronics industry, etc. | ||
Appreance | White powder |
Application:
lapping and polishing of semiconductor monocrystalline silicon wafers and crystal wafers and polishing of mobile phone metal casings.
Features: