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BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER
BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER
BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER
BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER
Specifications
Brand Name :
ZG
Model Number :
MS
Certification :
CE
Place of Origin :
CHINA
MOQ :
1 Piece
Price :
Negotiation
Payment Terms :
L/C, T/T, D/A, D/P, Western Union, MoneyGram
Supply Ability :
10000 pieces per month
Delivery Time :
7-10 work days
Packaging Details :
Strong wooden box for global shipping
Dimension(l*w*h) :
Customized
Bond type :
electroformed, metal (sintered), resin, and vitrified
Applicaiton :
Backgrinding Wheels
Feature :
Reduced sub-surface damage Excellent wheel wear characteristics
Description

Backgrinding Wheels

Backgrinding Wheels, are mainly used for the thinning and fine grinding of the silicon wafer

Our diamond wheels offer durability and accuracy by employing the most advanced engineering techniques and precision processing for back grind thinning.

Our particle holding strength minimizes processing contamination and provides high consistency throughout the product’s life with reduced sub-surface damage. A variety of standard offering are available depending on the material to be processed, however we can custom adjust and modify our formulations to satisfy the unique nature of most applications.

BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER

Advantages

  • Reduced sub-surface damage
  • Excellent wheel wear characteristics
  • Low heat generation
  • Optimized for shelf sharpening
  • Controlled diamond distribution
  • Consistent removal rates

Common Material Applications

  • Ceramic
  • Hard Alloy
  • Glass
  • Quartz
  • Sapphire
  • Silicon
  • Silicon Carbide

Common Tool Configurations

  • Disco®
  • Okamoto®
  • Strasbaugh®
  • TSK®

Please contact us for additional details.

Product tags

bonded abrasives grinding wheels

,

orient abrasives grinding wheels

,

pcd grinding wheels
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BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER

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Product Detail
Brand Name :
ZG
Model Number :
MS
Certification :
CE
Place of Origin :
CHINA
MOQ :
1 Piece
Price :
Negotiation
Contact Supplier
BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER
BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER

HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

Verified Supplier
5 Years
henan, zhengzhou
Since 2007
Business Type :
Manufacturer, Distributor/Wholesaler, Importer, Exporter
Main Products :
Sic Heating Elements, MoSi2 Heating Elements, Industrial Ceramic Parts
Total Annual :
5000000-8000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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