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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
Specifications
Brand Name :
HUITIAN
Model Number :
9504
Certification :
RoHS
Place of Origin :
CHINA
MOQ :
200 kg
Price :
Negotiation
Payment Terms :
L/C, T/T
Supply Ability :
2000T/Month
Delivery Time :
5-8 days
Packaging Details :
30cc/tube; 300cc/cartridge
Physical Form :
Paste
Color :
Pink
Density :
3.2 g/cm³
Extrusion flow rate :
20 g/min
Volume resistivity :
1.0*10^13 Ω∙cm
Dielectric strength :
8.0 KV/mm
Thermal Conductivity :
4 W/(m•K)
Description

9504 One-Component Pre-Curing Type Thermal Gel, which has no residual stress after sizing, effectively protects precision electronic components from damage

Product Description

  • Pink paste gel
  • One-part pre-curing type
  • Silicone thermal conductivity complex

Product Features:

  • High thermal conductivity 4W/m∙K
  • Very small BLT and very low thermal resistance
  • Soft adhesion and self-adhesive properties after dispensing
  • Excellent chemical and mechanical stability
  • No residual stress after sizing, effectively protects precision electronic components from damage

Technical Parameters

Reference standard Item Unit Value
GB/T 13354 Density g/cm3 3.2
-- Extrusion rate
(30ccEFD@90psi)
 g/min 30
ISO22007 Thermal conductivity W/ m·K 4.0
GB/T2408 Flame retardant / V0
GB/T2408 Volume resistivity Ω·cm ≥1.0×1013
ASTM D149 Dielectric strength Kv/mm 8.0
ASTM D5470 Minimum thickness mm 0.1

Main Applications:

  • Bare die chip low-stress mounting
  • Heat dissipation field of 5G communication boards
  • Automotive electronic equipment
  • Smart phone modules and consumer-electronics
  • Other high-value boards need to be reworked

Packing:

30cc/tube; 300cc/tube

Storage:

Store below 35°C in a cool and dry place.

Shelf life is 6 months.

9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
Product tags

thermal gap filler gel

,

silicone gel for electrical insulation

,

heat resistant silicon
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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

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Product Detail
Brand Name :
HUITIAN
Model Number :
9504
Certification :
RoHS
Place of Origin :
CHINA
MOQ :
200 kg
Price :
Negotiation
Contact Supplier
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics
9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

Shanghai Huitian New Material Co., Ltd

Verified Supplier
10 Years
shanghai, shanghai
Since 1977
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
PV Backsheet Material, PV Sealant, Potting Compound
Total Annual :
580,000,000-620,000,000
Employee Number :
1800~2000
Certification Level :
Verified Supplier
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