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0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal
0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal
0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal
0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal
Specifications
Brand Name :
HUITIAN
Model Number :
0113
Certification :
SGS
Place of Origin :
CHINA
MOQ :
50kg
Price :
Negotiation
Payment Terms :
L/C, T/T
Supply Ability :
1000kg/Month
Packaging Details :
2kg/bucket
Delivery Time :
5-8 days
Physical Form :
paste
Color :
white
Main Component :
polysiloxane
Density :
2.9g/cm³
Volatility(200℃,24h) :
0.2%
Working Temperature :
-50~200℃
Thermal Conductivity :
2.1W/(m•K)
Description

0113 TDS-EN.pdf

0113 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.

Product Features:

One-component, white;
Physical form: paste;
Wide working temperature range;
Nontoxic, non-corrosive to PCB and metal;
Eco-friendly, odorless;
Maintain dry and flowing at high temperature;
High performance on insulation, corona resistance, electric leakage resistance, and chemical resistance;
Can be manually glued or machine glued;
Thermal conductivity: 2.1W/m·K

Main Applications:

Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.

To fill the gap between high-power audion, thyristors and basic materials such as copper and aluminum reduce the temperature of electronic components.

Item Unit Typical Value
Item No. 0113
Physical Form paste
Color white
Main Component polysiloxane
Density g/cm3 2.9
Penetration Degree 1/10cm 280
Volatility(200℃,24h) % 0.2
Volume Resistivity Ω*cm 1.0×1015
Dielectric Strength KV/mm 24
Breakdown Voltage KV/mm 20
Surface Resistance Ω 2.4×1014
0.1mm Thermal Resistance m2K/W 0.00011
Work Temperature ℃ -50~200
Heat Conductivity Coefficient W/(m·K) 2.1

Packing:

2kg/bucket, 6bukets/carton

Storage:

Store it in dry and cool places at the temperature of 0~35℃

Shelf life is 12 months

0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal

0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal

Product tags

thermal conductive silicon grease

,

thermal conductivity silicone grease

,

silicone grease thermal conductivity
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0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal

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Product Detail
Brand Name :
HUITIAN
Model Number :
0113
Certification :
SGS
Place of Origin :
CHINA
MOQ :
50kg
Price :
Negotiation
Contact Supplier
0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal
0113 Thermal Conductive Grease 2.1W/m·K Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal

Shanghai Huitian New Material Co., Ltd

Verified Supplier
10 Years
shanghai, shanghai
Since 1977
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
PV Backsheet Material, PV Sealant, Potting Compound
Total Annual :
580,000,000-620,000,000
Employee Number :
1800~2000
Certification Level :
Verified Supplier
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