LWIR 384x288/17μM Uncooled Thermal Module For Medical Thermal Image Screening

iHA417W thermal module is specially developed for medical diagnosis. The captured temperature data and heat distribution of target can be used to achieve radiation-free, non-invasive early disease diagnosis and long-distance, large-scale body temperature screening.

It is mainly composed of wafer-level-packaging 384×288/17μm infrared detector, optical lens and SDK for temperature measurement with accuracy up to ±0.5℃.

Without external black body, the iHA417W thermal imaging module has a compact & light structure, which guarantees a lower integration cost. It has two modes of detect distance: 0.5m (for medical diagnosis) and 5m (for epidemic prevention and animal thermography).

iHA417W thermal camera module has an all-in-one standard Type-C interface with power supply, data transmission and control, customers can quickly develop and integrate various temperature measuring systems like medical diagnosis and epidemic prevention.

- Small Size: 25.4mm×25.4mm×30.3mm (with lens)
- Typical NETD<50mk
- Detect Distance: 0.5m/5m
- Light Weight as Low as 32.2g
- Superior Temperature Measurement Accuracy: ±0.5℃

The iHA417 thermal module is expected to be widely used in the fields of Disease Screening, Traditional Chinese Medicine Physiotherapy, Health Check-up, Rehabilitation etc. at present and in the future.

1. What is the difference between uncooled and cooled IR detectors?

There are currently two types of infrared thermal imaging sensors on the market, cooled and uncooled.

Uncooled IR detector operates at ambient temperature. It is based on semi-conductor industry and thus usually can be fabricated in big volume with small size and low cost. Uncooled IR detectors are widely used in portable/handheld/mobile devices.

Cooled IR detectors are packaged in a unit that keeps them at an extremely low temperature which shall be supported by a cryo cooler. They are much bigger, more expensive and less reliable than uncooled sensors, mainly due to the complex cooling systems they require. However, the cooled systems are incredibly sensitive and usually work with long focal length optics to achieve long range mission.

2. About Wafer Level Packaging Infrared Detector

Wafer-level packaging, also known as wafer-level size packaging, has become an important part of advanced packaging technology in the semiconductor industry. Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector. It performs most or all of the packaging and testing procedures directly on the IR detector wafer before dicing.

It is an improved chip size package that meets the needs of small size, lightweight, portable, handheld, low price and high production efficiency.