Surplus designed process and rinse tanks are constructed from a single sheet of application specific plastic material that is CNC machined and then folded into the form of your tank using the “ORIGAMI” method. Welded corners can create particle/contamination traps and can leak due to workmanship, thermal cycling, and/ or prolonged chemical exposure. However, the “ORIGAMI” method minimizes welding and provides smooth, seamless, rounded interior corners.
The “ORIGAMI” design and fabrication approach combined with over 40 years of wet process experience provides optimum process and rinse results at the lowest possible cost.
PTFE Welded Wet Etching High-Temperature Process Tanks For Semiconductor Wet Process Features:
Custom-mode product to be manufactured by our experienced welders to the
satisfaction of the customer. The maximum size we delivered is 2.0 m × 2.5 m × 2.0 m.
PTFE Welded Wet Etching High-Temperature Process Tanks For Semiconductor Wet Process Main applications:
• Washing tank (Silicon wafer etc.)
• Washing tank for temperature control
• Storage of chemical
PTFE Welded Wet Etching High-Temperature Process Tanks For Semiconductor Wet Process Characteristics:
• The mold is not required, and is economical for smaller lots.
• Free designs are possible to meet various needs.
Model
|
PTFE Process Tank
|
---|---|
Tank Material
|
PTFE (thickness
dependent on tank size) |
Construction
|
Folded corner origami,
flushed weld seams |
Connections
|
PFA Flared
stems standard |
Max. operating
temperature |
100-200°C*
|
Optional Cooling Coils
|
Corrugated PFA tube
|
Limited Warranty
|
One Year
|