Specifications
Brand Name :
Hiner-pack
Model Number :
JEDEC TRAY SERIES
Place of Origin :
China
Certification :
ISO 9001 SGS ROHS
MOQ :
1000 pcs
Price :
TBC
Packaging Details :
80~100pcs/carton
Delivery Time :
1~2 Weeks
Payment Terms :
100% Prepayment
Supply Ability :
2000PCS/Day
Application :
IC Packaging
Tray Weight :
120~200g
Tray Features :
Stackable
Material :
MPPO.PPE.ABS.PEI.IDP
Tray Shape :
Rectangular
IC Type :
BGA,QFP,QFN,LGA,PGA
Height :
7.62mm
Size :
322.6*135.9mm
Description

Product Description:

JEDEC matrix trays measure 12.7 x 5.35 inches (322.6 x 136 mm) in width and length, respectively. These trays have a low profile thickness of 0.25-inch (6.35mm). This design is suitable for storing and transporting 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC.

Features:

Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor manufacturing equipment. For many decades of history and wide and far application, there have been many products to support JEDEC matrix trays.

Packaging – At the heart of it all, the JEDEC matrix trays serve as containers. The outline of the JEDEC matrix trays comes with stacking capabilities, with the top tray locking the bottom one in place.

Transportation & Storage – Parts that are kept inside the stacked JEDEC matrix trays are simple to keep or tranport everywhere, be it several steps away or even cross-country. Moreover, JEDEC matrix trays also double up as “boats” during industrial processes, as they can hold the parts in transit through various process equipment.

Protection – Contained parts inside the JEDEC matrix trays are protected from mechanical damage. Moreover, most of the JEDEC matrix trays are manufactured with the material that is able to ward off ESD damage.

BGA QFP QFN LGA PGA IC Type Jedec Trays Surface Resistant Suitable For IC Packaging

Technical Parameters:

JEDEC Matrix Trays are designed to protect and accurately hold parts in an automated environment. This makes them ideal for companies which utilize pick and place automation systems and standardized process equipment. Not only that, they simplify automation programming tasks with their well defined component pattern.

They can be used to hold a variety of components, such as semiconductors, electronic components, optical and photonic products and purely mechanical parts. Generally, they are built with ESD-safe engineering plastic to prevent static electricity discharges.

Applications:

Jedec IC Trays

Hiner-pack's Jedec IC Trays are the perfect solution for electronic components IC chips. With ISO 9001 SGS ROHS certification, the trays' minimum order quantity is 500 pieces and the delivery time is 1~2 weeks. Each carton contains 80~100 pieces and the tray weight is 120~200g. The trays are stackable, 7.62mm in height and suitable for IC chips like BGA, QFP, QFN, LGA and PGA. Apart from core tray racking, the trays are also applicable for IC packaging tray and IC tray.

The trays are made of high-quality material and have a strong structure, making them efficient and reliable. 2000 trays can be supplied per day and the price is TBC. Payment terms are 100% prepayment. With Hiner-pack's Jedec IC Trays, electronic components IC chips can be stored safely and securely.

BGA QFP QFN LGA PGA IC Type Jedec Trays Surface Resistant Suitable For IC Packaging

Customization:

Customized JEDEC Trays, from Hiner-pack, are designed for electronic components IC chipset packaging and core tray racking. The model number is JEDEC TRAY SERIES, certified with ISO 9001 SGS ROHS. The minimum order quantity is 500, and the price is TBC. The packaging details are 80~100pcs/carton, the delivery time is 1~2 weeks, and payment terms are 100% Prepayment. The supply ability is 2000PCS/Day. The tray height is 7.62mm, suitable for IC packaging like BGA, QFP, QFN, LGA, PGA, etc. The tray shape is rectangular, and the tray weight ranges from 120~200g.

FAQ:

Q: What is the brand of the Jedec IC Trays?
A: The brand of the Jedec IC Trays is Hiner-pack.
Q: What is the model number of the Jedec IC Trays?
A: The model number of the Jedec IC Trays is JEDEC TRAY SERIES.
Q: Where is the Jedec IC Trays made?
A: The Jedec IC Trays are made in China.
Q: What certifications do the Jedec IC Trays have?
A: The Jedec IC Trays have ISO 9001 SGS ROHS certifications.
Q: How many Jedec IC Trays are required for a minimum order?
A: The minimum order quantity for Jedec IC Trays is 500.
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BGA QFP QFN LGA PGA IC Type Jedec Trays Surface Resistant Suitable For IC Packaging

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Brand Name :
Hiner-pack
Model Number :
JEDEC TRAY SERIES
Place of Origin :
China
Certification :
ISO 9001 SGS ROHS
MOQ :
1000 pcs
Price :
TBC
Contact Supplier
video
BGA QFP QFN LGA PGA IC Type Jedec Trays Surface Resistant Suitable For IC Packaging
BGA QFP QFN LGA PGA IC Type Jedec Trays Surface Resistant Suitable For IC Packaging
BGA QFP QFN LGA PGA IC Type Jedec Trays Surface Resistant Suitable For IC Packaging
BGA QFP QFN LGA PGA IC Type Jedec Trays Surface Resistant Suitable For IC Packaging

Shenzhen Hiner Technology Co.,LTD

Verified Supplier
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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