Specifications
Brand Name :
Hiner-pack
Model Number :
HN21093
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$0.35~$0.85(Prices are determined according to different incoterms and quantities)
Payment Terms :
T/T
Supply Ability :
The capacity is between 4000PCS~5000PCS/per day
Delivery Time :
5~8 working days
Packaging Details :
It depends on the QTY of order and size of product
Material :
ABS
Color :
Black
Flatness :
MAX 0.2mm
Design :
Non-standard
Surface Resistance :
1.0x10E4~1.0x10E11Ω
Clean class :
General And Ultrasonic Cleaning
Injection Mold :
Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Use :
Transport,Storage,Packing
Description

Black ABS Waffle Pack Chip Tray for Optical Device

The Waffle Pack is widely used in semiconductor, photoelectric industry. The product requires a high degree of cleanliness and size. From the design drawings, mold manufacturing, product manufacturing to cleaning packing , all of the steps and operations through strict quality control. To deliver the ultimate goal of customer satisfaction for product, our company continuously meet the customer's requirements and promote our factory to a higher level of progress.

1.Details about The HN21093 Black ABS Waffle Pack Chip Tray for Optical Device

The HN21093 Waffle Pack is a tray made of industrial plastics. The raw material can be recycled, and it is easy to be degraded after waste. There is no concern about environmental protection. It is small in size, light in weight and low in transportation cost.

At the same time, the 20*20 matrix can hold a large number of products, which is suitable for transfer or loading sample testing. The Hiner-pack also produces covers and clamps ,which are suitable for fastening and transporting all kinds of waffle packs.

Outline Line Size 50.7*50.7*4mm Brand Hiner-pack
Model HN21093 Package Type Bare Die
Cavity Size 0.95*1.25*0.46 Matrix QTY 20*20=400PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

2.Product Application

Optical device packaging Electrical equipment and systems
Electronic component packaging Wafer Die / Bare / Chips

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

3.Advantages

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production.

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years experience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

Non Standard Black ABS Waffle Pack Chip Trays For Optical Device Case

4.FAQ

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Non Standard Black ABS Waffle Pack Chip Trays For Optical Device Case

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Non Standard Black ABS Waffle Pack Chip Trays For Optical Device Case

Ask Latest Price
Brand Name :
Hiner-pack
Model Number :
HN21093
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$0.35~$0.85(Prices are determined according to different incoterms and quantities)
Contact Supplier
Non Standard Black ABS Waffle Pack Chip Trays For Optical Device Case
Non Standard Black ABS Waffle Pack Chip Trays For Optical Device Case
Non Standard Black ABS Waffle Pack Chip Trays For Optical Device Case
Non Standard Black ABS Waffle Pack Chip Trays For Optical Device Case

Shenzhen Hiner Technology Co.,LTD

Verified Supplier
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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