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Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare
Specifications
Brand Name :
Hiner-pack
Model Number :
To meet all kinds of custom needs of customers
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
It depends on the structure of the product
Payment Terms :
T/T
Supply Ability :
Refer to Specified Items
Delivery Time :
5~8 working days
Packaging Details :
It depends on the QTY of order and size of product
Material :
ABS.PC.PPE.MPPO...etc
Color :
Black.Red.Yellow.Green.White..etc
Property :
ESD,Non-ESD
Design :
Standard and Non-standard
Size :
All kinds of
Surface Resistance :
1.0x10E4~1.0x10E11Ω
Clean class :
General And Ultrasonic Cleaning
Incoterms :
EXW,FOB,CIF,DDU,DDP
Injection Mold :
Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method :
Injection Moulding
Description

Electronic Components IC Tray Injection Moulding For Wafer Bare

Various Kinds Of Electronic Components Trays Customized Samples

For electronic products in the process of transportation and packing unavoidably will produce some friction, from the perspective of physics, friction causes electrostatic generation, and the temperature change in the weather outside, and will produce static electricity, the electrostatic if stay in electronic products, it is easy to cause a short-circuit damage to the precision of electronic products,In order to avoid this situation so its packaging materials require the use of good anti-static function of the pallet or packaging solutions.

Our company has skillful and well-trained team in the field of Semiconductor packaging design to work out customer's requirements,for instance,different temperature,color,ESD property and cleanliness class etc.Experienced product structure engineering team can design various of IC chip,wafer,precision components packaging methods and specifications and other special demands to fit you well.

Application


Semiconductor Wafer Die Wafter Bare, Electronic components, optical electronic components, etc

Character Reference

Industrial Use:Electronic
Feature:Recyclable
Custom Order:Accept
Place of Origin:Shenzhen, China (Mainland)
Brand Name:Hiner-pack
Model Number:HN1808
Surface resistance:10e4-10e11 ohms
Color:Black
Property:Antistatic/ESD
Thickess:7.62mm
CAD drawing:available
Customized:width, length, thickness as customer request
Offer Designing:Yes

Customized Size
Item Material ABS / PC / MPPO / PPE... acceptable
OEM&ODM YES
Item Color Can be customized
Feature Durable;Reusable;Rcofriendly;Biodegradable
Sample A. The free samples: choosen from existing products.
B. customized samples as per your design/demand
MOQ 500pcs.
Packing Carton or as per customer's request
Delivery time Usually 8-10 working days,depends on order quantity
Term of payment Products:100% prepayment.
Mold:50% T/T deposit, 50% balance after sample confirmation

Electronic Components IC Tray Injection Moulding For Wafer Bare

FAQ

Q1. Do your products get any certificates?
Yes, CE for EU market, FDA for USA market.

Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into perfect fact. It does not matter if you do not have some one to complete files. Send us high resolution images, your logo and text and tell us how you would like to arrange them. We will send you finished files for confirmation.

Q3. How long is the delivery time?
For standard machine, it would be 5-7Working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.

Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L and other certificates as required by clients.

Electronic Components IC Tray Injection Moulding For Wafer Bare

Product tags

calculator plastic injection molding

,

pcs mold components

,

electronics injection molding
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Electronic Components IC Tray Injection Moulding For Wafer Bare

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Product Detail
Brand Name :
Hiner-pack
Model Number :
To meet all kinds of custom needs of customers
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
It depends on the structure of the product
Contact Supplier
Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare
Electronic Components IC Tray Injection Moulding For Wafer Bare

Shenzhen Hiner Technology Co.,LTD

Verified Supplier
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
Jedec IC Trays, Jedec Matrix Trays, IC Chip Tray
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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