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Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Specifications
Brand Name :
Hiner-pack
Model Number :
HN1839 Black
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms :
T/T
Supply Ability :
The capacity is between 2500PCS~3000PCS/per day
Delivery Time :
5~8 working days
Packaging Details :
80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Material :
MPPO.PPE.ABS.PEI.IDP...etc
Color :
Black.Red.Yellow.Green.White..etc
Temperature :
80°C~180°C
Property :
ESD,Non-ESD
Surface resistance :
1.0x10E4~1.0x10E11Ω
Flatness :
less than 0.76mm
HS Code :
39239000
Use :
Transport,Storage,Packing
Description
Recycled ESD Custom Jedec Trays Transport BGA Chips High Temperature
Customize JEDEC Standard High Temperature Black IC Tray For BGA Chips

Character Reference

Material: PPE

Thickness: 7.62,12.19mm

Appearance: black

Customized: width and length, thickness as customer request

Conductive: 10e4-10e6 ohms

Anti-static: 1.0*10e4-1.0*10e11 ohms

The design of the structure and shape in line with JEDEC international standards can also perfectly meet the requirements of the carriing components or IC of the tray, carriing function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, improve work efficiency.

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.

Benefits

Able to present non-standard components to Pick and Place machines

Multiple uses for fixture including component bake-out, storage and shipping

Cost effective alternative to “tape and reel” or “hand” placement

Application:

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

Model HN1839 Package Type BGA IC
Cavity Size 12*12*1.8mm Size Customized
Material PPE Flatness MAX 0.76mm
Resistance 1.0x10e4-1.0x10e11Ω Service Accept OEM,ODM
Color Green &Black Certificate ROHS
Usage Packaging of Electronic Components,Optical device,
Feature ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
Material MPPO.PPE.ABS.PEI.IDP...etc
Color Black.Red.Yellow.Green.White and custom color
Size Customized size, rectangle,circle shape
Mold type Injection Mold
Design Original sample or we can create the designs
Packing By Carton
Sample Sample time: after draft confirmed and payment arranged
Sample charge: 1. Free for stock samples
2. Custom Tray negotiated
Lead Time 5-7 Working days
The exact time should according to the ordered quantity

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C

FAQ

Q1. Do your products get any certificates?
Yes, CE for EU market, FDA for USA market.

Q2.Can you do the design for us?
Yes. We have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into perfect fact. It does not matter if you do not have some one to complete files. Send us high resolution images, your logo and text and tell us how you would like to arrange them. We will send you finished files for confirmation.

Q3. How long is the delivery time?
For standard machine, it would be 5-7Working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.

Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Q5. How about the documents after shipment?
After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L and other certificates as required by clients.

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C

Product tags

thermocouple type k table

,

thermocouple k type table

,

depanelizer pcb
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Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C

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Product Detail
Brand Name :
Hiner-pack
Model Number :
HN1839 Black
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Contact Supplier
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Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C
Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C

Shenzhen Hiner Technology Co.,LTD

Verified Supplier
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
Jedec IC Trays, Jedec Matrix Trays, IC Chip Tray
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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