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BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
Specifications
Brand Name :
Hiner-pack
Model Number :
HN2074
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms :
T/T
Supply Ability :
The capacity is between 2500PCS~3000PCS/per day
Delivery Time :
5~8 working days
Packaging Details :
80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Material :
PPE
Color :
Black
Temperature :
80°C~180°C
Property :
ESD, Non-ESD
Surface resistance :
1.0x10E4~1.0x10E11Ω
Flatness :
less than 0.76mm
Clean Class :
General and ultrasonic cleaning
Incoterms :
EXW,FOB,CIF,DDU,DDP
Customized service :
Support standard and non-standard,precision machining
Injection mold :
Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.)
Description
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
Customized Reusable High Temperature Anti-Static Holder For BGA Chips
Jedec trays is a standard-defined tray for transporting, handling, and storing complete chips and other components,and the production come in the very same outline dimensions of 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm). Trays come in a number of different profiles .

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray .

Hiner offer the ultimate protection and convenience. We offer a wide variety of JEDEC outline matrix trays to satisfy the most demanding requirements of today's automatic test and handling environments. While JEDEC standards provide compatibility with process equipment, every device and component has its own requirements for tray pocket details .

Our Advantages

1. Flexible OEM service: we can produce products according to customer’s sample or design.
2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding,Production
4. Comprehensive customer service: from customer consultation to after sales service.
5. 10 years’ex perience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

Product Application

Electronic component Semiconductor Embedded System Display technology
Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply

Outline Line Size322.6*135.9*7.62mmBrandHiner-pack
ModelHN 2074Package TypeBGA IC
Cavity Size10.8*5.3*1.1mmMatrix QTY22*9=198PCS
MaterialPPEFlatnessMAX 0.76mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS

MaterialBake TemperatureSurface Resistance
PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

Product tags

marmox insulation board

,

fr4 pcb temperature rating

,

fosroc thermal insulation board
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BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

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Product Detail
Brand Name :
Hiner-pack
Model Number :
HN2074
Certification :
ISO 9001 ROHS SGS
Place of Origin :
Made In China
MOQ :
1000 pcs
Price :
$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Contact Supplier
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials

Shenzhen Hiner Technology Co.,LTD

Verified Supplier
5 Years
guangdong, shenzhen
Since 2013
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller, Other
Main Products :
Jedec IC Trays, Jedec Matrix Trays, IC Chip Tray
Total Annual :
5,000,000.00-10,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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